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Table of Contents
A foundry is an IC fabrication facility.
List of foundries
- foundry:ams
- foundry:bae
- foundry:csm
- foundry:cypress
- foundry:dongbu
- foundry:globalfoundries
- foundry:grace
- foundry:hejian
- foundry:honeywell
- foundry:ibm
- foundry:infineon
- foundry:intel
- foundry:intersil
- foundry:lockheed
- foundry:magnachip
- foundry:microchip
- foundry:micron
- foundry:national
- foundry:nec
- foundry:ng
- foundry:nsa
- foundry:on
- foundry:peregrine
- foundry:raytheon
- foundry:samsung
- foundry:sandia
- foundry:sarnoff
- foundry:seiko
- foundry:sharp
- foundry:silterra
- foundry:smic
- foundry:ssmc
- foundry:st
- foundry:ti
- foundry:towerjazz
- foundry:triquint
- foundry:tsmc
- foundry:umc
- foundry:unknown
- foundry:vis
- foundry:xfab
- foundry:yamaha
SSMC
0.25 um - 0.14 um 200 mm and 300 mm wafers
Northrup Gruman
Nortrup Grumman Electronic Systems (Blatimore, MD) Northrup Grumman Space Technology (Redondo Beach, CA)
Peregrine
Processes
- GA @ 0.25 µm
- GC @ 0.25 µm
- FA @ 0.50 µm
- FC @ 0.50 µm
Rayethon RF Components
Andower, MA
SAMSUN Semiconductor
Processes
- 90 nm
- 65 nm
- 45 nm
- 45/40nm
- 32/28nm
300 mm wafers
Sarnoff Corporation
Princeton, NJ
Semiconductor Manufacturing International Corporation (SMIC)
0.35 um to 90nm
Taiwan Semiconductor Manufacturing Company Limited (TSMC)
Produces ICs for many third parties include such large organizations as nVidia. TODO: image some nVidia chips to see if we can capture some identifying marks. Processes
- CLN40/CMN40 @ 40 nm
- CLN45/CMN45 @ 45 nm
- CLN65/CMN65 @ 65 nm
- CLN90/CMN90 @ 90 nm
- CL013/CM013 @ 0.13 µm
- CL013LP @ 0.13 µm
- CL013LV @ 0.13 µm
- CL018/CM018 @ 0.18 µm
- CL018HV @ 0.18 µm
- CL018LP @ 0.18 µm
- CL018LV @ 0.18 µm
- CL025/CM025 @ 0.25 µm
- CL035/CM035 @ 0.35 µm
- CL035HV_BCD @ 0.35 µm
- CL035HV_DDD @ 0.35 µm
- “65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm”
- azonenberg:altera:epm3064a
- azonenberg:micrel:ksz9021rn
- azonenberg:micrel:ksz9031rnx
- azonenberg:microchip:enc424j600
- azonenberg:microchip:pic32mx340f512h
- azonenberg:microchip:pic32mz2048ech
- azonenberg:nvidia:mcpx
- azonenberg:silabs:cp2102
- azonenberg:siliconimage:sil164
- azonenberg:st:stm32l431
- azonenberg:ti:am1707bzkb3
- infosecdj:cern:vfat3b
- infosecdj:siemens:sab-80c517a
- mcmaster:raspberry-pi:rp2-b0
- mcmaster:xilinx:xc7a35t
- mcmaster:xilinx:xc73108-pc84ack
Texas Instruments (TI)
Processes
- 32 nm
- 45 nm
- 90 nm
- 130 nm
- 200 mm wafers
TowerJazz
Israel: 6” and 8”
US: 8”
China “manufacturing partnerships”
“silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies”
TriQuint Semiconductor
TriQuint Semiconductor Texas (Richardson, TX)
United Microelectronic Corporation (UMC)
Processes
- 28 nm
- 40 nm
- 65 nm
- 90 nm
- 0.13 um
- 0.15 um
- 0.18 um
- 0.25 um
- 0.35 um
- 0.5 um
- 0.6 um
- 8“ wafers
- azonenberg:ftdi:ft232h
- azonenberg:ftdi:ft2232h
- azonenberg:microchip:23k256
- azonenberg:semtech:sx1243
- azonenberg:xilinx:xc2c32a
- azonenberg:xilinx:xc2c64a
- azonenberg:xilinx:xc2c128
- azonenberg:xilinx:xc2c512
- azonenberg:xilinx:xc3s50a
- azonenberg:xilinx:xc3s50an
- azonenberg:xilinx:xc3s400a
- azonenberg:xilinx:xc3s1000
- azonenberg:xilinx:xcr3064xl
- bercovici:novatek:nt6868ah
- mcmaster:xilinx:xc2c32a
- mcmaster:xilinx:xc2c256
- mcmaster:xilinx:xc2s50-tq144ams0517
- mcmaster:xilinx:xc3s50a
- mcmaster:xilinx:xc4028xl-hq240cmn9841
- mcmaster:xilinx:xc9572-pq100asj9805
- mcmaster:xilinx:xc95108-pq100akj9837
- mcmaster:xilinx:xc95216-pq160bsj9833
Vanguard International Semiconductor Corporation (VIS)
0.18um to 0.5um
8” wafers
X-FAB Semiconductor Foundries
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
