Chip is from RP2040 (Raspberry Pi Pico). More images here

Package

RP2-B0 20/34
P64M15.OQ TTT



Die

RP2 B0 2020(C)

M8 R0
M7 R0
V6 B0

mz_mit20x

  • Single (4861×4721, 8171000B)

s1-9_mit20x

  • Single (4932×4798, 7180040B)

s1-9_vc60x

  • Single (14876×14436, 38.8783MiB)
Process step Process Notes
s1-1 2 min 20% hf
2 min hcl/h2o2
minor corrosion on top metal
s1-2 2 min 20% hf
1 min hcl/h2o2
2 min barrier
s1-3 3 min 20% hf
2 min barrier
4 min hcl/h2o2
misc process issues causing unintended times
significant top metal erosion of some sort
see stringers floating around
s1-4 3 min 20% hf
2 min hcl/h2o2
4 min barrier
significant erosion into oxide
looks like maybe some wax residue on die?
Gentle IPA scrub w/ foam tip removed it
s1-5 2 min 20% hf
2 min hcl/h2o2
4 min barrier
much more etching
lots of transistors exposed
keep going at this cadence
scrubbed die again to remove residue
s1-6 2 min 20% hf
2 min hcl/h2o2
4 min barrier
s1-7 2 min 20% hf
2 min hcl/h2o2
no barrier
Getting close to done
No barrier and no residue
Barrier etch must be eating wax
s1-8 2 min 20% hf
2 min hcl/h2o2
no barrier
getting close to done
s1-9 2 min 20% hf
2 min hcl/h2o2
no barrier
Very small oxide left
Call it good enough
 
mcmaster/raspberry-pi/rp2-b0.txt · Last modified: 2021/01/30 22:18 by mcmaster
 
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