Package
256-ball BGA, 1mm pitch.
Die
65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution.
Size is approximately 5970 x 4370 μm (26.1 mm2).
Bottom left corner logo. Note “TI” logo upside-down relative to text.
Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much).
Upper left corner alignment markings
Damaged bond pad showing underlying layers
Test pattern in scribe line
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