See also: xc3s50a


No shot available right now :(

Known to be die rev A.


Size is approximately 3200 x 2850 μm (9.12 mm2)

M8 with intact passivation

M8 with passivation removed


M6 and below could not be revealed cleanly with HF etching, need to CMP another die.


Might be some poly too.

Left side of block RAM

Gap between two groups of CLBs

azonenberg/xilinx/xc3s50a.txt · Last modified: 2015/01/04 22:50 (external edit)
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