NVIDIA MCPX (labeled MCP1 on the die) southbridge from the original Xbox. Alleged to contain the secret boot ROM.
Made by a 150 nm 7-metal process by TSMC according to http://amo.net/NT/02-15-01XBOX.html.
From preliminary die inspection, stack-up looks to be:
- M7 = bond pads, horizontal power distribution, long-range horizontal interconnect
- M6 = routing to bond pads, vertical power distribution, long-range vertical interconnect
- M5 = medium-range vertical interconnect
- M4 = medium-range horizontal interconnect
- M3 = short-range vertical interconnect
- M2 = short-range horizontal interconnect
- M1 = intra-cell routing
Package
Markings:
(logo) nVIDIA (R) MCPX X3 F45819.1 0142B2 A TAIWAN
Die
Size is approximately 5300 x 5300 μm (28.1 mm2)
Die logo
Mask rev markings. Looks very similar to the GeForce 2 MX suggesting the two are made on the same, or nearly same, process. This is a little odd since the GeForce 2 was supposed to be 180 nm and sources list this chip as 150.
Classic NVIDIA diagonal bond pads
Possible boot ROM?
Multi-focus stack down interconnect. Looks like 3 vertical, 3 horizontal layers plus M1 (not visible in this view).
Closeup near bottom right showing cell sizes
