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Table of Contents

Decapsulation
Delayering
Image Analysis
Probing
External

This page is an index of articles describing procedures in detail, illustrated by photos from contributors' laboratories. The level of background knowledge required may vary and not all tutorials are complete; many are still evolving.

MCU security series

Decapsulation

Epoxy decapsulation for die recovery
- Heated 70% nitric acid
Epoxy decapsulation for live analysis
- Heated 70% nitric acid + dropper
Silver plated copper decapsulation
- Isolate the epoxy covered die from the majority carrier

Delayering

Using a lapping machine

Image Analysis

Digitizing with Inkscape
- Manually convert an IC to vector graphics
Pr0ntools

Probing

Using micropositioners
- Probing ICs for live analysis
Making bond wire probes
- Too cheap to buy precision probe tips? Use bond wires. This article is obsolete, the method described in the article below gives much better results.
Etching tungsten probes
- This is how most real probe tips are made.

External

Cold, Labless HNO3 Decapping Procedure by Travis Goodspeed
- RFNA room temperature epoxy decapsulation
HOW TO: write an IC Friday post
- Sulphuric acid epoxy decapsulation
SparkFun ATmega slug decapsulation
- RFNA + heat epoxy decapsulation
pwr2own layout CTF

tutorial/start.txt · Last modified: 2021/12/24 22:29 by mcmaster

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