- Sample prep
Invasive techniques actively modify the system in a permanent way.
Fabs often thin wafers and perform backside analysis to get at the transistors without going through metal. [Functional IC Analysis] doesn't look like they thinned and they got pretty decent results.
Sample preparation example: http://jiam.utk.edu/new/PDF/Allied-Backside-Thinning.pdf
The “professional” mid range solution. Typically some form of Nd:YAG, either the fundamental or some harmonic. Expect minimum of a few thousand USD for a system, probably many more. Probably the most economical would be to piece together a Mitutoyo microscope. Of course, be careful not to look into your home spun laser while firing without good reason.
The “professional” high end solution used for small processes. Equipment is rather expensive. Some estimates seem to put them around an order of magnitude of 500,000 USD.
FIB time can often be rented on an hourly basis from universities and research labs.
azonenberg is beginning to experiment with FIB. Lab notes
Microprobes can cut traces by moving back and forth. Professional units use peizo's (ie ultrasound).
By masking the chip and then etching (ex: with HF) wires can be removed. Masking compounds range from photoresists to nail polish.
Usually done with a fib. Can be done temporarily with microprobes or possibly on a high process chip very carefully with conductive epoxy.
JM's highlights from watching the presentation
op amp vs ttl amp for gain
No mention of masked etching. Ex: putting PR or nail polish and etching with HF