Decapsulation is the process of removing a die from or exposing a die in a package.

Live analysis considerations

Depending on the carrier type, different techniques need to be used.

Epoxy

Main article

In order to protect the fragile die, epoxy is mechanically strong and very chemical resistant. Strong chemicals, mechanical abrasion, or heat treatments can be used to remove epoxy. This is the most common packaging and possibly also the hardest.

Ceramic

Main article

Fired ceramic with metal parts. Often sealed with glass and metal.

Epoxy and metal

Main article

Hot running chips often require heat sinks and are integrated directly into the package.

Can

See metal

Some packages are fully metallic. Usually these are transistors, but military ICs also came (still do?) in these as well.

Plastic

Main article

Typically used for smart cards.

 
decap/start.txt · Last modified: 2013/10/20 18:59 (external edit)
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