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United Microelectronic Corporation (UMC)
4-5 metal layers.
Partial design rules and FIB sections at http://siliconexposed.blogspot.com/2014/02/process-overview-umc-180nm-envm.html
Layouts can vary, as does presence or absence of CMP filler between bond pads.
CMP fill pattern table (measured from XC2C32A)
Layer | Width | Height | X pitch (μm) | Y pitch (μm) | Conditions |
---|---|---|---|---|---|
M4 | 3375 | 6140 | 3975 | 6975 | Overglass |
M4 | 1875 | 4875 | 3915 | 6870 | Bare metal |
M3 | 3000 | 825 | 3870 | 1960 | With overglass removed, M4 present |
M3 | 3075 | 1125 | 3952 | 1995 | With M3 removed |