foundry:start
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Table of Contents
A foundry is an IC fabrication facility.
List of foundries
- foundry:ams
- foundry:bae
- foundry:csm
- foundry:cypress
- foundry:dongbu
- foundry:globalfoundries
- foundry:grace
- foundry:hejian
- foundry:honeywell
- foundry:ibm
- foundry:infineon
- foundry:intel
- foundry:intersil
- foundry:lockheed
- foundry:magnachip
- foundry:microchip
- foundry:micron
- foundry:national
- foundry:nec
- foundry:ng
- foundry:nsa
- foundry:on
- foundry:peregrine
- foundry:raytheon
- foundry:samsung
- foundry:sandia
- foundry:sarnoff
- foundry:seiko
- foundry:sharp
- foundry:silterra
- foundry:smic
- foundry:ssmc
- foundry:st
- foundry:ti
- foundry:towerjazz
- foundry:triquint
- foundry:tsmc
- foundry:umc
- foundry:unknown
- foundry:vis
- foundry:xfab
- foundry:yamaha
Texas Instruments (TI)
Processes
- 32 nm
- 45 nm
- 90 nm
- 130 nm
- 200 mm wafers
TowerJazz
Israel: 6” and 8”
US: 8”
China “manufacturing partnerships”
“silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies”
TriQuint Semiconductor
TriQuint Semiconductor Texas (Richardson, TX)
United Microelectronic Corporation (UMC)
Processes
- 28 nm
- 40 nm
- 65 nm
- 90 nm
- 0.13 um
- 0.15 um
- 0.18 um
- 0.25 um
- 0.35 um
- 0.5 um
- 0.6 um
- 8“ wafers
- azonenberg:ftdi:ft232h
- azonenberg:ftdi:ft2232h
- azonenberg:microchip:23k256
- azonenberg:semtech:sx1243
- azonenberg:xilinx:xc2c32a
- azonenberg:xilinx:xc2c64a
- azonenberg:xilinx:xc2c128
- azonenberg:xilinx:xc2c512
- azonenberg:xilinx:xc3s50a
- azonenberg:xilinx:xc3s50an
- azonenberg:xilinx:xc3s400a
- azonenberg:xilinx:xc3s1000
- azonenberg:xilinx:xcr3064xl
- bercovici:novatek:nt6868ah
- mcmaster:xilinx:xc2c32a
- mcmaster:xilinx:xc2c256
- mcmaster:xilinx:xc2s50-tq144ams0517
- mcmaster:xilinx:xc3s50a
- mcmaster:xilinx:xc4028xl-hq240cmn9841
- mcmaster:xilinx:xc9572-pq100asj9805
- mcmaster:xilinx:xc95108-pq100akj9837
- mcmaster:xilinx:xc95216-pq160bsj9833
Vanguard International Semiconductor Corporation (VIS)
0.18um to 0.5um
8” wafers
X-FAB Semiconductor Foundries
“CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP”
References
foundry/start.1388187675.txt.gz · Last modified: 2013/12/27 23:41 by azonenberg