2015-09-06
2015-09-13
2015-09-26
Virtex die
Mostly decapped already by soaking in WFNA for a few days
Used piranha etch to clean up
Discovered remaining black epoxy/silicone doesn't quickly etch in piranha
Still have a pile of ones that require decap cleanup
Should have plenty for lapping R&D for a while
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Sample:
Lapping stencil
Idea: try to get closer to wafer lapping by not gluing chip down
Requires making a stencil to hold die in place
Use wax to affix stencil to fixture
Still using lapping films. Looking into getting condition rings + cast iron plate
All material: 0.01“ ⇒ 0.254 mm
Kimwipe: 0.056 mm
Lapping jig stencil holder?
Stencil cutting holder
Hold stencil in place on milling machine
Lapping surface 2” ⇒ 50.8 mm diameter
Lapping jig cavity: 57.1 mm
Lapping stencil target diameter: 54 mm
Support at least entire cavity size + 1/8“ endmill ⇒ 57.1 + 1/8 * 25.4 = 60.3 mm
Add some good clearance so I don't mill the jig: 5 mm each side ⇒ 70 mm total ID ⇒ 2.75”
0.5“ each side ⇒ 3.75” Al square stock
1.5“ from sherline t-slot to slot