Pin grid array:

Single inline package (SIP)

Usually resistor networks but also used for soldered modules/cards and ocassionally ICs.

Ceramic SIP:

Dual inline package (DIP)

Plastic DIP (PDIP)

These are actually made of epoxy and glass. They come in varying number of pins and widths. Pins are on a 0.1” spacing and package widths are typically seperated by 0.3“ or more in 0.1” increments.

0.6“ PDIP-40 (UMC UM82c55A), a pretty typical DIP:

umc_um82c55a_top.jpg umc_um82c55a_bot.jpg

Older style chip with chip large die cavity (added after molding?):

fd1791-b01_top.jpg fd1791-b01_bot.jpg

An unusual PDIP which doesn't fully encapsulate the leadframe:

One major disadvantage of PDIPs is their relatively poor heat conduction being made primarily of glass. A 0.3” PDIP-14 with heatsink:

heatsink_top.jpg heatsink_bot.jpg

Colored PDIPs are uncommon but do exist. The most common are resistor networks which are typically orange. 0.3“ PDIP-16 (Dale MCP1605):

dale_top.jpg dale_bot.jpg dale_side.jpg

True Plastic DIP

PDIPs made of plastic do exist but they are rare. They are typically used for resistor networks. However, as resistor networks put off heat and epoxy generally takeas heat better than plastic, even most resistor networks are encapsulated in epoxy instead of plastic. Generally these are colored such that they stand out very obviously from epoxy or ceramic chips. I'm not sure of any standard name for these so I'm going to call them Plastic PDIP (PPDIP) since their namesake was taken by PDIPs.

0.3” PPDIP-16 (330 ohm resistor network):

16-1-330_top.jpg 16-1-330_bot.jpg 16-1-330_side.jpg

Ceramic DIP (CDIP or CERDIP)

Was popular before epoxy (“plastic”) chips were made commercially viable.


A typical package has two fired ceramic halves with a die in a center cavity held together by glass. Most windowed chips are of this type.

Its unusual to have the ceramic darker on part of the chip but it does make for a nice label! I have several that are identical (to the datecode) but does not have this black background…error during silkscreening process?

wd_wd8250cl-00_top.jpg wd_wd8250cl-00_bot.jpg wd_wd8250cl-00_side.jpg

Erasable chips (typically EPROM but sometimes microcontrollers containing EPROM) have a quartz window:

microchip_pic17c64_top.jpg microchip_pic17c64_bot.jpg microchip_pic17c64_side.jpg


A typical package is a single co-fired ceramic with a solderable lid. Optional grounding strap. These chips were more common in the 70/80s but still continue to see use in high end and military chips. The last consumer chip I'm aware of was the Pentium 1 which used a dark purple ceramic.

Pretty typical package:

intel_c2186-25_top.jpg intel_c2186-25_bot.jpg intel_c2186-25_side.jpg

Slight variation with the grounding strap soldered directly to the lid:

ti_tms99105ajdl_top.jpg ti_tms99105ajdl_bot.jpg ti_tms99105ajdl_side.jpg

An unusual package with pins to stack another chip on top (for EPROM for the MCU IIRC in this case):

nat_semi_ns87p50d-11_top.jpg nat_semi_ns87p50d-11_bot.jpg nat_semi_ns87p50d-11_side.jpg

An unusual package with a lid covering the entire top:


intel_c8751-8_top.jpg intel_c8751-8_bot.jpg intel_c8751-8_side.jpg

Old windowed package with frosted glass (uncommon):

hitachi_hd462532_top.jpg hitachi_hd462532_bot.jpg hitachi_hd462532_side.jpg


A typical package is a single co-fired ceramic with a solderable lid. Optional grounding strap. These chips became uncommon after the 80's in favor of plastic and darker ceramics.

With metal lid and grounding strap:

nec_d7220d-1_top.jpg nec_d7220d-1_bot.jpg nec_d7220d-1_side.jpg

A little unusual co-fired ceramic thick film resistor pack:

beckman_898-5_top.jpg beckman_898-5_bot.jpg beckman_898-5_side.jpg

An unusual chip with ceramic sandwhiched by metal plates. I'm unclear if this was co-fired or how the metal was attached?

rc31360_top.jpg rc31360_bot.jpg rc31360_side.jpg

This chip is a little unusual in that the gold lid appears to have been painted over to make the chip look uniform white! You can see gold where the lid was scratched. 1978 date code

white_cb2082_top.jpg white_cb2082_bot.jpg

Early ceramic package (1974 date code):

white_fd502e_top.jpg white_fd502e_bot.jpg

Early windowed ceramic package (window missing, 1979 date code?):

intel_c8702a-4_lidless_top.jpg intel_c8702a-4_lidless_bot.jpg intel_c8702a-4_lidless_side.jpg


Old style:

motorola_k1114r_top.jpg motorola_k1114r_bot.jpg motorola_k1114r_side.jpg


carrier/th.txt · Last modified: 2013/10/28 14:22 by mcmaster
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