Misc:

• CCGA: ceramic column grid array (CGA)
• CGA: column grid array
• CERPACK: ceramic package
• CQGP:
• LLP: Lead Less lead frame Package, a package with metric pin distribution (0.5 mm - 0.8 mm pitch)
• LGA: Land Grid Array
• LTCC: Low temperature co-fired ceramic
• MCM: Multi-Chip Module
• MICRO SMDXT: micro Surface Mount Device extended technology
• MELF: Metal Electrode Leadless Face (usually for resistors and diodes)
• SOD: Small Outline Diode.
• Tape automated bonding (TAB): technique used to feed chips in to a pick n' place

Chip carrier:

• BCC: Bump Chip Carrier
• CLCC: Ceramic Leadless Chip Carrier
• LCC: Leadless Chip Carrier, contacts are recessed vertically.
• LCC: Leaded Chip Carrier
• LCCC: Leaded Ceramic Chip Carrier
• DLCC: Dual Lead-Less Chip Carrier (Ceramic)
• PLCC: Plastic Leaded Chip Carrier

Flat:

• Flatpack, early metal/ceramic case with flat leads
• CFP: Ceramic Flat Pack
• CQFP: ceramic quad flat-pack, similar to PQFP
• BQFP: Bumpered Quad Flat Pack
• DFN: Dual Flat Pack, No Lead
• ETQFP: Exposed Thin Quad Flat Package
• PQFN: power quad flat-pack, no-leads, with exposed die-pad[s] for heatsinking
• PQFP: Plastic quad flat package
• LQFP: Low-profile Quad Flat Package
• QFN: Quad Flat No Leads, also called micro lead frame (MLF)
• Quad Flat Package: (QFP)
• MQFP - Metric Quad Flat Pack,a QFP with metric pin distribution
• HVQFN: Heat-sink very-thin quad flat-pack no-leads
• SIDEBRAZE:
• TQFP: Thin Quad Flat Pack
• TQFN: Thin Quad Flat No-Lead
• VQFB: Very-thin Quad Flat Pack

Small outline:

• CSOP: ceramic SOP
• MSOP: Mini Small-Outline Package
• PSOP: Plastic small-outline package
• QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm
• SOIC: Small Outline Integrated Circuit (Also SOIC NARROW and SOIC WIDE).
• SOP: Small Outline Package
• SSOP: Shrink Small-Outline Package
• TSOP: Thin Small-outline Package
• TSSOP: Thin Shrink Small Outline Package
• TVSOP: Thin Very Small-Outline Package
• μMAX: Similar to a SOIC. (A Maxim trademark example)
• WSON: Very Very Thin Small Outline No Lead Package

Ball grid array

• FBGA: fine pitch ball grid array, with a square or rectangular array of solder balls on one surface
• LBGA : Low Profile Ball Grid Array (see BGA) (als * Laminate Ball Grid Array)
• TEPBGA: Thermally Enhanced Plastic BGA.
• CBGA: Ceramic Ball Grid Array
• OBGA: Organic Ball Grid Array
• TFBGA - thin fine pitch BGA.
• PBGA: Plastic Ball Grid Array
• UCSP: Similar t * a BGA (A Maxim trademark example)
• μBGA - micro-BGA (Ball grid array), with ball spacing less than 1 mm
• LFBGA - low profile fine pitch ball grid array
• TBGA: Thin Ball Grid Array
• SBGA: Super BGA - above 500 Pin count
• UFBGA: Ultra Fine BGA

Transistor outline (TO):

• TO-3
• TO-5
• TO-18: metal can package with radial leads
• TO-39
• TO-46
• TO-92: plastic encapsulated package with three leads
• TO-99
• TO-100
• TO-220: plastic package with a (usually) metal heat sink tab and three leads
• TO-252
• TO-263
• TO-263 THIN

Small outline transistor (SOT):

• SOT-23
• SOT-223
• SOT-323

References