Gray SecurID
Images
Die markings
SMSC 2C 2C
2C5737 18A
-1P89
Chip structure
Die is approximately 2.9 X 3.1 mm
Process technology
2-metal nonplanar CMOS, fairly large dimensions (1um? 750nm?). Based on standard cells with approximately 16 horizontal interconnect channels on M1 between rows of cells and vertical interconnect on M2.
CPU
12 rows of standard cells, no estimates of total gate count yet.
Based on memory architecture it's likely a 16 bit design.
Memory
First array (top center, red)
Best guess so far is mask ROM
Two identical banks with column addressing circuitry in the middle, row addressing at right
Each bank consists of 128 rows
Data bus at center left is 16 bits wide
Probable structure: 16 bits x 256 rows = 4k bits
Closeup of column outputs. Looks like 16 data bits.
Second array (top left, gray)
Best guess so far is SRAM
One bank with column addressing circuitry on top and row addressing circuitry at left
16 columns, 64 rows
Probable structure: 16 bits x 64 rows = 1k bits
Current issue SID700