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Table of Contents
Die IDs
| Die ID | Die year | Chip | Notes |
|---|---|---|---|
| 74AK2 | 1979 1988 1993 | 24LC00 | In PIC12CE518 |
| 77015 | PIC16C57 |  : different osc are different ID |
|
| 97021 | PIC16C558 | ||
| ? | PIC16C74A | Similar to 97074 | |
| 97044 | PIC17C44 | ||
| 97074 | 1979 1988 1995 | | Asked to ID |
| A7A32 | Windowed damaged | Hard to read (may be wrong) | |
| A7AA1? | PIC16C57C | ||
| A7AL8 | PIC12CE518 CPU die | ||
| BEBA1 | PIC10F200 | Both codes on same physical die | |
| D5008 | PIC16F59 | ||
| DE024 | PIC12F683 | ||
| DEDZ2 | 24LC256 | ||
| TDAA0 | PIC32MX695F512H | ||
| TGAA0 | ENC424J600 | Both codes on same physical die | |
| TGAA1 | ENC424J600 | Both codes on same physical die | |
| WAAA0 | PIC32MZ2048ECH | Both codes on same physical die | |
| WAAA1 | PIC32MZ2048ECH | Both codes on same physical die | |
| X2BA3 | PIC10F200 | Both codes on same physical die | |
| YG009 | ENC28J60 | ||
| YGAE2 | PIC18F24J10 | ||
| YPAA0 | PIC32MX340F512H |
Fabs/processes
Definitely some in-house fabs, unknown what levels.
Known outsource fabs:
- TSMC (180nm) from change notice
- X-Fab (??)
- UMC (180nm) from CMP filler pattern
Change notices
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=IIRA-08MVZQ035&opennew=n
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=IIRA-30XLTU681&opennew=n
Most DSPIC33EP, a few recent PIC18F, PIC24EP, PIC24FJ, ENC424, and many PIC32MX3/4/5/6/7 are TSMC 180nm.
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=IIRA-24SWKB890&opennew=n
Mask code TLAC* is DSPIC33EP64 and PIC24EP64
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=IIRA-02LFGN963&opennew=n
More mask code info
http://www.microchip.com/mymicrochip/NotificationDetails.aspx?pcn=CYER-08NFNO242&opennew=n
SST flash info
Chips
