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Die IDs

Die ID Die year Chip Notes
74AK2
1979

1988

1993
24LC00 In PIC12CE518
77015 PIC16C57 FIXME : different osc are different ID
97021 PIC16C558
97023 1995 PIC16C554
? PIC16C74A Similar to 97074
97044 PIC17C44
97074 1979

1988

1995
PIC16C74
“Title: 97074 PIC16C74 CMOS PIC.” (Ref)
A7A32 Windowed damaged Hard to read (may be wrong)
A7AA1? PIC16C57C
A7AL8 PIC12CE518 CPU die
BEBA1 PIC10F200 Both codes on same physical die
D5008 PIC16F59
DE024 PIC12F683
DEDZ2 24LC256
TDAA0 PIC32MX695F512H
TGAA0 ENC424J600 Both codes on same physical die
TGAA1 ENC424J600 Both codes on same physical die
WAAA0 PIC32MZ2048ECH Both codes on same physical die
WAAA1 PIC32MZ2048ECH Both codes on same physical die
X2BA3 PIC10F200 Both codes on same physical die
YG009 ENC28J60
YGAE2 PIC18F24J10
YPAA0 PIC32MX340F512H

Fabs/processes

Definitely some in-house fabs, unknown what levels.

Known outsource fabs:

  • TSMC (180nm) from change notice
  • X-Fab (??)
  • UMC (180nm) from CMP filler pattern

Change notices

Chips

 
vendor/microchip.txt · Last modified: 2017/10/15 12:38 by mcmaster
 
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