This is an old revision of the document!

Home

Top level

• Component
  • Capacitor
  • Diode
  • Fuse/anti-fuse (AF)
  • Pad
  • Resistor
  • Test pattern
  • Transistor
  • Via
  • Wire bonding
  • Process Technology
• Device
  • Memory
  • PLD
• Sample prep
  • Decapsulation
  • Delayering
  • Cleaning
  • Wire bonding
    • Bond removal
    • Re-bonding
  • Chemicals
• Equipment
• Invasive analysis
  • Physical protection
• Logic families
  • CMOS
  • Bipolar
• Misc
• Semi-invasive analysis
• Related work
• Analysis
  • Software
  • Layout colors
• Tutorial
• Quiz
• Copying