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A typical PDIP:
Part that has the actual active circuitry on it. Typically a few mm thick and can vary considerably in length and width. Most are rectangular in shape. This is a very complex part made of primarily silicon and silicon dioxide (SiO2), but also including aluminium, copper, arsenic, phosphorus, and more.
Its purpose is to protect the fragile die contained within. This includes physical stress and chemical stress such as moisture. On more advanced chips, it may also provide radiation protection or protections against reverse engineering. Typically an epoxy resin mixed with various additives such as glass.
Leads to provide a strong external connection to the internal circuitry.
The center portion is called by many names. Some of them include:
As Beck's failure analysis is a well written published work I originally referred to it as a “carrier island.” However, die attach paddle or simply “paddle” seems to be the most common so I've standardized on that.
Thin, usually gold, wires to electrically connect the leadframe to the die. They are typically welded die or connected via conductive epoxy. Connection to the leadframe is probably welded, need some evidence though.