carrier:die_attach
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Die attach materials [Plastic MEMS 49, sourced as Pecht et al., 1999…I have no idea where it lies in the giant book]:
- Silicone
- Urethane
- Acrylic
- Epoxy silicone
- Epoxy novlak
- Polymide
- Epoxy polymide
- Modified polymide
- Epoxy bisphenol
“Common materials used in packaging…Die bonding” [Plastic MEMS 52]:
- Solder alloys
- Epoxy resins
- Silicone rubber
Die attach materials [Plastic MEMS 70]:
- Polymer: resin based epoxies or polymides
- Solder die attach
- Gold eutectic die attach
From datasheets:
- Ablestik 8361J [Mindspeed product change note]
- CRM-M0209 [Mindspeed product change note]
- Ablestik 84-1 LMISR4 [Mindspeed product change note]
- Ablestik 3230 [Mindspeed product change note]
- Ablestik 8361H [Cypress S32456]
References
- Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf
- Mindspeed product change note: http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf
- Cypress S32456: http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf
carrier/die_attach.1367719786.txt.gz · Last modified: 2013/10/20 14:59 (external edit)