carrier:die_attach
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Die attach materials [Plastic MEMS 49, sourced as Pecht et al., 1999…I have no idea where it lies in the giant book]:
- Silicone
- Urethane
- Acrylic
- Epoxy silicone
- Epoxy novlak
- Polymide
- Epoxy polymide
- Modified polymide
- Epoxy bisphenol
“Common materials used in packaging…Die bonding” [Plastic MEMS 52]: solder alloys, epoxy resins, silicone rubber
References
- Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf
carrier/die_attach.1367385958.txt.gz · Last modified: 2013/10/20 14:59 (external edit)