carrier:die_attach

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Die attach materials [Plastic MEMS 49, sourced as Pecht et al., 1999]:

References

Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf

carrier/die_attach.1367385454.txt.gz · Last modified: 2013/10/20 14:59 (external edit)