Source: https://web.archive.org/web/20210301211140/https://twitter.com/Siliconinsid/status/1366463072462909446
Text: IBM 65X6603 (1990)
Inside the metal can is a ceramic module with several surface mount capacitors and two flip chip silicon dies. Its functions are mysterious, just as IBM part numbers are.
#IBM #Hybrid

Package

Die




 
bercovici/ibm/65x6603.txt · Last modified: 2024/07/02 06:15 (external edit)
 
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