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Xilinx CoolRunner-II CPLD with 32 macrocells. The -A version supports two I/O banks while the baseline XC2C32 only has one.
180nm 4-metal process.
Die size: 1895 x 1710 μm (3.24 mm^2)
Junction between VCCIO1 (left) and VCCIO2 (right) at bottom center of die. Note vias from ground ring to ground pad at bottom.