This is an old revision of the document!
TODO: move this to individual vendors if it becomes comprehensive enough
Based off of data from Materials Declaration of 8L CerDIP: http://www.analog.com/static/imported-files/packages/39260738806786CerDIP_8.pdf
Assembly | Component | Material | % component | % Assembly % | % package |
---|---|---|---|---|---|
Base | Ceramics | Al2O3 | 62.11 | 20.36 | |
MnO2 | 2.38 | 0.78 | |||
SiO2 | 2.02 | 0.66 | |||
TiO2 | 1.28 | 0.42 | |||
Cr2O3 | 1.01 | 0.33 | |||
Fe2O3 | 0.82 | 0.27 | |||
MgO | 0.37 | 0.12 | |||
CaO | 0.03 | 0.01 | |||
Co3O4 | 0.18 | 0.06 | |||
Sealing glass | PbO | 13.28 | 4.35 | ||
SnO2 | 3.48 | 1.14 | |||
SiO2 | 1.56 | 0.51 | |||
B2O3 | 8.12 | 2.66 | |||
Al2O3 | 0.92 | 0.30 | |||
TiO2 | 1.28 | 0.42 | |||
MgO | 0.46 | 0.15 | |||
ZnO | 0.18 | 0.06 | |||
CaO | 0.46 | 0.15 | |||
Cr2O3 | 0.03 | 0.009 | |||
Fe2O3 | 0.03 | 0.009 | |||
MnO2 | 0.009 | 0.003 | |||
Na2O | 0.002 | 0.0006 | |||
Lid | Ceramics | Al2O3 | 62.59 | 31.33 | |
MnO2 | 2.40 | 1.20 | |||
SiO2 | 2.00 | 1.00 | |||
TiO2 | 1.30 | 0.65 | |||
Cr2O3 | 1.00 | 0.50 | |||
Fe2O3 | 0.80 | 0.40 | |||
Co3O4 | 0.20 | 0.10 | |||
MgO | 0.40 | 0.20 | |||
CaO | 0.03 | 0.02 | |||
Sealing glass | PbO | 17.90 | 8.96 | ||
SnO2 | 4.60 | 2.30 | |||
SiO2 | 2.20 | 1.10 | |||
B2O3 | 1.70 | 0.85 | |||
Al2O3 | 1.20 | 0.60 | |||
MgO | 0.70 | 0.35 | |||
CaO | 0.70 | 0.35 | |||
ZnO | 0.20 | 0.10 | |||
Cr2O3 | 0.04 | 0.02 | |||
Fe2O3 | 0.04 | 0.02 | |||
MnO2 | 0.01 | 0.005 | |||
Misc | Leadframe | Fe | 58.405 | 7.01 | |
Ni | 40.883 | 4.90 | |||
Mn | 0.521 | 0.06 | |||
Si | 0.130 | 0.02 | |||
Co | 0.030 | 0.004 | |||
Cr | 0.010 | 0.001 | |||
Al | 0.010 | 0.001 | |||
S | 0.006 | 0.0007 | |||
C | 0.003 | 0.0004 | |||
P | 0.002 | 0.0002 | |||
Paste | Ag | 80 | 0.80 | ||
Pb-borate glass | 20 | 0.20 | |||
Chip | Si | 100 | 0.06 | ||
Bonding wires | Al | 100 | 0.10 | ||
Solder | Sn | 63 | 2.52 | ||
Pb | 37 | 1.48 |
http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf
Based off of data from http://www.foxonline.com/pdfs/materialdeclarations/XpressO%203225%20Materials.pdf
Assembly | Component | Material | % component | % package |
---|---|---|---|---|
Cover | Kovar | Ni | 3.70 | |
Co | 2.16 | |||
Fe | 6.80 | |||
Ni plating | Ni | 0.73 | ||
P | 0.08 | |||
Base | Ceramic | Al2O3 | 90.13 | 11.69 |
SiO2 | 6.40 | 6.40 | ||
0.45 | 3.47 | 3.47 | ||
Total | 100.0 | 12.97 | ||
Metalization | W | 8.07 | ||
Mo | 0.42 | |||
Ni plating | Ni | 42.47 | 0.31 | |
Co | 57.53 | 0.42 | ||
Au plating | Au | 100 | 0.75 | |
Seal ring | Fe | 6.74 | ||
Ni | 3.62 | |||
Co | 2.12 | |||
Ag solder | Ag | 2.41 | ||
Cu | 0.42 | |||
IC | IC | Al | 0.125 | |
Si | 1.919 | |||
Au | Au | 0.333 | ||
Adhesive | Ag | 0.708 | ||
Phenolic resin | 0.062 | |||
Epoxy resin | 0.062 | |||
Crystal | Crystal | SiO2 | 2.91 | |
Electrode | Ag | 0.0491 | ||
Cr | 0.0008 | |||
Adhesive | Ag | 0.083240 | ||
Si | 0.016648 |
http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf
Product change notification that describes switch from Skyworks to Amkor encapsulation provider.
Mindspeed product change note, 80 pin PQFP
Mindspeed product change note, 128 pin LQFP
Mindspeed product change note, 128 pin LQFP
Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72
Component | Overall material | Material | % component | % package |
---|---|---|---|---|
Base | Alumina | Al2O3 | 30.85 | |
SiO2 | 3.43 | |||
Cup | Alumina | Al2O3 | 30.85 | |
SiO2 | 3.43 | |||
Leadframe | Alloy 42 | Fe | 7.64 | |
Ni | 5.54 | |||
Sealing glass | Silicates | PbO | 9.79 | |
SiO2 | 1.57 | |||
Misc | 7.11 | |||
Chip (doped Si) | Si | 0.44 | ||
Al | 0.0026 | |||
Die bonding | Ag glass | Ag | 0.048 | |
Pb | 0.003 | |||
Misc | 0.009 | |||
Wires (Al) | Al | 0.04 | ||
Leadfinishing | Sn | Sn | 0.30 |
Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 86
Component | Overall material | Material | % component | % package |
---|---|---|---|---|
Leadframe | Cu alloy, Ag plating | Cu | 27.40 | |
Fe | 0.65 | |||
P | 0.028 | |||
Ag | 0.028 | |||
Encapsulation | Epoxy resin | SiO2 | 49 | |
Epoxy | 19 | |||
Sb2O3 | 1.4 | |||
Br (TBBA) | 0.7 | |||
Chip | Doped Si | Si | 0.994 | |
Al | 0.006 | |||
Die bonding | Glue | Ag | 0.038 | |
Epoxy resin | 0.013 | |||
Wires | Au | Au | 0.15 | |
Leadfinishing (Non-RoHS?) | Sn/Pb | Sn | 0.42 | |
Pb | 0.28 | |||
Leadfinishing (RoHS?) | Sn | Sn | 0.7 |
Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 88. This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better thermal conductivity
Component | Overall material | Material | % component | % package |
---|---|---|---|---|
Leadframe | Cu alloy, Ag plating | Cu | 45.53 | |
Fe | 1.07 | |||
P | 0.047 | |||
Ag | 0.047 | |||
Encapsulation | Epoxy resin | SiO2 | 35.70 | |
Epoxy | 13.77 | |||
Sb2O3 | 1.02 | |||
Br (TBBA) | 0.51 | |||
Chip | Doped Si | Si | 0.994 | |
Al | 0.006 | |||
Die bonding | Soft solder | Pb | 0.300 | |
Sn | 0.016 | |||
Ag | 0.0048 | |||
Wires | Au | Au | 0.25 | |
Leadfinishing (Non-RoHS?) | Sn/Pb | Sn | 0.62 | |
Pb | 0.11 | |||
Leadfinishing (RoHS?) | Sn | Sn | 0.73 |