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Ceramic

Based off of data from Materials Declaration of 8L CerDIP: http://www.analog.com/static/imported-files/packages/39260738806786CerDIP_8.pdf

Assembly	Component	Material	% Assembly %	% package
Base	Ceramics	Al2O3	62.11	20.36
		MnO2	2.38	0.78
		SiO2	2.02	0.66
		TiO2	1.28	0.42
		Cr2O3	1.01	0.33
		Fe2O3	0.82	0.27
		MgO	0.37	0.12
		CaO	0.03	0.01
		Co3O4	0.18	0.06
	Sealing glass	PbO	13.28	4.35
		SnO2	3.48	1.14
		SiO2	1.56	0.51
		B2O3	8.12	2.66
		Al2O3	0.92	0.30
		TiO2	1.28	0.42
		MgO	0.46	0.15
		ZnO	0.18	0.06
		CaO	0.46	0.15
		Cr2O3	0.03	0.009
		Fe2O3	0.03	0.009
		MnO2	0.009	0.003
		Na2O	0.002	0.0006
Lid	Ceramics	Al2O3	62.59	31.33
		MnO2	2.40	1.20
		SiO2	2.00	1.00
		TiO2	1.30	0.65
		Cr2O3	1.00	0.50
		Fe2O3	0.80	0.40
		Co3O4	0.20	0.10
		MgO	0.40	0.20
		CaO	0.03	0.02
	Sealing glass	PbO	17.90	8.96
		SnO2	4.60	2.30
		SiO2	2.20	1.10
		B2O3	1.70	0.85
		Al2O3	1.20	0.60
		MgO	0.70	0.35
		CaO	0.70	0.35
		ZnO	0.20	0.10
		Cr2O3	0.04	0.02
		Fe2O3	0.04	0.02
		MnO2	0.01	0.005
Misc	Leadframe	Fe	58.405	7.01
		Ni	40.883	4.90
		Mn	0.521	0.06
		Si	0.130	0.02
		Co	0.030	0.004
		Cr	0.010	0.001
		Al	0.010	0.001
		S	0.006	0.0007
		C	0.003	0.0004
		P	0.002	0.0002
	Paste	Ag	80	0.80
		Pb-borate glass	20	0.20
	Chip	Si	100	0.06
	Bonding wires	Al	100	0.10
	Solder	Sn	63	2.52
		Pb	37	1.48

Fox

XpressO 3.2x2.5mm Ceramic

Based off of data from http://www.foxonline.com/pdfs/materialdeclarations/XpressO%203225%20Materials.pdf

Assembly	Component	Material	% component	% package
Cover	Kovar	Ni		3.70
		Co		2.16
		Fe		6.80
	Ni plating	Ni		0.73
		P		0.08
Base	Ceramic	Al2O3	90.13	11.69
		SiO2	6.40	6.40
		0.45	3.47	3.47
		Total	100.0	12.97
	Metalization	W		8.07
		Mo		0.42
	Ni plating	Ni	42.47	0.31
		Co	57.53	0.42
	Au plating	Au	100	0.75
	Seal ring	Fe		6.74
		Ni		3.62
		Co		2.12
	Ag solder	Ag		2.41
		Cu		0.42
IC	IC	Al		0.125
		Si		1.919
	Au	Au		0.333
	Adhesive	Ag		0.708
		Phenolic resin		0.062
		Epoxy resin		0.062
Crystal	Crystal	SiO2		2.91
	Electrode	Ag		0.0491
		Cr		0.0008
	Adhesive	Ag		0.083240
		Si		0.016648

Microchip

http://ww1.microchip.com/downloads/en/EnvironmentalInformation/Material%20Content%20Declarations_MCDg.pdf

Mindspeed

http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎

Product change notification that describes switch from Skyworks to Amkor encapsulation provider.

Skyworks

http://www.skyworksinc.com/

Mindspeed product change note

Mold compound: Sumitomo 6650E
Die Attach: Ablestik 8361J
Lead Frame: Cu 194
Lead Coating: 85/15 Sn/Pb
Wire: 1.25 mil Au
Marking: Ink

Amkor

http://www.amkor.com/

Mindspeed product change note, 80 pin PQFP

Mold compound: Nitto MP8000CH4
Die Attach: Ablestik 8361J
Lead Frame: Cu 194
Lead Coating: 85/15 Sn/Pb
Wire: 1.0 mil Au
Marking: Ink

Mindspeed product change note, 128 pin LQFP

Mold compound: Sumitomo 7320CR
Die Attach: Ablestik 84-1 LMISR4
Lead Frame: Cu 194
Lead Coating: 85/15 Sn/Pb
Wire: 1.0 mil Au
Marking: Ink

ST

CerDIP

Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72

Component	Overall material	Material	% package
Base	Alumina	Al2O3	30.85
		SiO2	3.43
Cup	Alumina	Al2O3	30.85
		SiO2	3.43
Leadframe	Alloy 42	Fe	7.64
		Ni	5.54
Sealing glass	Silicates	PbO	9.79
		SiO2	1.57
		Misc	7.11
Chip (doped Si)		Si	0.44
		Al	0.0026
Die bonding	Ag glass	Ag	0.048
		Pb	0.003
		Misc	0.009
Wires (Al)		Al	0.04
Leadfinishing	Sn	Sn	0.30

PDIP (standard)

Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 86

Component	Overall material	Material	% package
Leadframe	Cu alloy, Ag plating	Cu	27.40
		Fe	0.65
		P	0.028
		Ag	0.028
Encapsulation	Epoxy resin	SiO2	49
		Epoxy	19
		Sb2O3	1.4
		Br (TBBA)	0.7
Chip	Doped Si	Si	0.994
		Al	0.006
Die bonding	Glue	Ag	0.038
		Epoxy resin	0.013
Wires	Au	Au	0.15
Leadfinishing (Non-RoHS?)	Sn/Pb	Sn	0.42
		Pb	0.28
Leadfinishing (RoHS?)	Sn	Sn	0.7

PDIP (power)

Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 88. This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better thermal conductivity

Component	Overall material	Material	% package
Leadframe	Cu alloy, Ag plating	Cu	45.53
		Fe	1.07
		P	0.047
		Ag	0.047
Encapsulation	Epoxy resin	SiO2	35.70
		Epoxy	13.77
		Sb2O3	1.02
		Br (TBBA)	0.51
Chip	Doped Si	Si	0.994
		Al	0.006
Die bonding	Soft solder	Pb	0.300
		Sn	0.016
		Ag	0.0048
Wires	Au	Au	0.25
Leadfinishing (Non-RoHS?)	Sn/Pb	Sn	0.62
		Pb	0.11
Leadfinishing (RoHS?)	Sn	Sn	0.73

Xilinx

package

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