This is an old revision of the document!
TODO: move this to individual vendors if it becomes comprehensive enough
Based off of data from Materials Declaration of 8L CerDIP: http://www.analog.com/static/imported-files/packages/39260738806786CerDIP_8.pdf
| Assembly | Component | Material | % component | % Assembly % | % package |
|---|---|---|---|---|---|
| Base | Ceramics | Al2O3 | 62.11 | 20.36 | |
| MnO2 | 2.38 | 0.78 | |||
| SiO2 | 2.02 | 0.66 | |||
| TiO2 | 1.28 | 0.42 | |||
| Cr2O3 | 1.01 | 0.33 | |||
| Fe2O3 | 0.82 | 0.27 | |||
| MgO | 0.37 | 0.12 | |||
| CaO | 0.03 | 0.01 | |||
| Co3O4 | 0.18 | 0.06 | |||
| Sealing glass | PbO | 13.28 | 4.35 | ||
| SnO2 | 3.48 | 1.14 | |||
| SiO2 | 1.56 | 0.51 | |||
| B2O3 | 8.12 | 2.66 | |||
| Al2O3 | 0.92 | 0.30 | |||
| TiO2 | 1.28 | 0.42 | |||
| MgO | 0.46 | 0.15 | |||
| ZnO | 0.18 | 0.06 | |||
| CaO | 0.46 | 0.15 | |||
| Cr2O3 | 0.03 | 0.009 | |||
| Fe2O3 | 0.03 | 0.009 | |||
| MnO2 | 0.009 | 0.003 | |||
| Na2O | 0.002 | 0.0006 | |||
| Lid | Ceramics | Al2O3 | 62.59 | 31.33 | |
| MnO2 | 2.40 | 1.20 | |||
| SiO2 | 2.00 | 1.00 | |||
| TiO2 | 1.30 | 0.65 | |||
| Cr2O3 | 1.00 | 0.50 | |||
| Fe2O3 | 0.80 | 0.40 | |||
| Co3O4 | 0.20 | 0.10 | |||
| MgO | 0.40 | 0.20 | |||
| CaO | 0.03 | 0.02 | |||
| Sealing glass | PbO | 17.90 | 8.96 | ||
| SnO2 | 4.60 | 2.30 | |||
| SiO2 | 2.20 | 1.10 | |||
| B2O3 | 1.70 | 0.85 | |||
| Al2O3 | 1.20 | 0.60 | |||
| MgO | 0.70 | 0.35 | |||
| CaO | 0.70 | 0.35 | |||
| ZnO | 0.20 | 0.10 | |||
| Cr2O3 | 0.04 | 0.02 | |||
| Fe2O3 | 0.04 | 0.02 | |||
| MnO2 | 0.01 | 0.005 | |||
| Misc | Leadframe | Fe | 58.405 | 7.01 | |
| Ni | 40.883 | 4.90 | |||
| Mn | 0.521 | 0.06 | |||
| Si | 0.130 | 0.02 | |||
| Co | 0.030 | 0.004 | |||
| Cr | 0.010 | 0.001 | |||
| Al | 0.010 | 0.001 | |||
| S | 0.006 | 0.0007 | |||
| C | 0.003 | 0.0004 | |||
| P | 0.002 | 0.0002 | |||
| Paste | Ag | 80 | 0.80 | ||
| Pb-borate glass | 20 | 0.20 | |||
| Chip | Si | 100 | 0.06 | ||
| Bonding wires | Al | 100 | 0.10 | ||
| Solder | Sn | 63 | 2.52 | ||
| Pb | 37 | 1.48 |
Based off of data from http://www.foxonline.com/pdfs/materialdeclarations/XpressO%203225%20Materials.pdf
| Assembly | Component | Material | % component | % package |
|---|---|---|---|---|
| Cover | Kovar | Ni | 3.70 | |
| Co | 2.16 | |||
| Fe | 6.80 | |||
| Ni plating | Ni | 0.73 | ||
| P | 0.08 | |||
| Base | Ceramic | Al2O3 | 90.13 | 11.69 |
| SiO2 | 6.40 | 6.40 | ||
| 0.45 | 3.47 | 3.47 | ||
| Total | 100.0 | 12.97 | ||
| Metalization | W | 8.07 | ||
| Mo | 0.42 | |||
| Ni plating | Ni | 42.47 | 0.31 | |
| Co | 57.53 | 0.42 | ||
| Au plating | Au | 100 | 0.75 | |
| Seal ring | Fe | 6.74 | ||
| Ni | 3.62 | |||
| Co | 2.12 | |||
| Ag solder | Ag | 2.41 | ||
| Cu | 0.42 | |||
| IC | IC | Al | 0.125 | |
| Si | 1.919 | |||
| Au | Au | 0.333 | ||
| Adhesive | Ag | 0.708 | ||
| Phenolic resin | 0.062 | |||
| Epoxy resin | 0.062 | |||
| Crystal | Crystal | SiO2 | 2.91 | |
| Electrode | Ag | 0.0491 | ||
| Cr | 0.0008 | |||
| Adhesive | Ag | 0.083240 | ||
| Si | 0.016648 |
Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72
| Component | Overall material | Material | % component | % package |
|---|---|---|---|---|
| Base | Alumina | Al2O3 | 30.85 | |
| SiO2 | 3.43 | |||
| Cup | Alumina | Al2O3 | 30.85 | |
| SiO2 | 3.43 | |||
| Leadframe | Alloy 42 | Fe | 7.64 | |
| Ni | 5.54 | |||
| Sealing glass | Silicates | PbO | 9.79 | |
| SiO2 | 1.57 | |||
| Misc | 7.11 | |||
| Chip (doped Si) | Si | 0.44 | ||
| Al | 0.0026 | |||
| Die bonding | Ag glass | Ag | 0.048 | |
| Pb | 0.003 | |||
| Misc | 0.009 | |||
| Wires (Al) | Al | 0.04 | ||
| Leadfinishing | Sn | Sn | 0.30 |