Table of Contents

SRAM+Flash hybrid FPGA contains an XC3S50A die from Xilinx and an Atmel DataFlash die wire-bonded together.

The die ID code of the FPGA (X8701) matches the regular XC3S50A.

Full-die imagery of the FPGA was not acquired because the die is identical to the regular XC3S50A, which has already been imaged.

Package

Label:

  (X) XILINX (R)
  SPARTAN (R)
  XC3S50AN (TM)
  TQG144AGQ1341
  D4631772A
  4C
  

Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air.

Flash die

FPGA die

The FPGA die is covered by an overcoat which can be scratched off with a scalpel blade but does not respond to acid. Possibly some sort of polyimide?

 
azonenberg/xilinx/xc3s50an.txt · Last modified: 2015/01/04 17:50 (external edit)
 
Except where otherwise noted, content on this wiki is licensed under the following license: CC Attribution 4.0 International
Recent changes RSS feed Donate Powered by PHP Valid XHTML 1.0 Valid CSS Driven by DokuWiki