Package

256-ball BGA, 1mm pitch.

Die

65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution.

Size is approximately 5970 x 4370 μm (26.1 mm2).

Bottom left corner logo. Note “TI” logo upside-down relative to text.

Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much).

Upper left corner alignment markings

Damaged bond pad showing underlying layers

Test pattern in scribe line

 
azonenberg/ti/am1707bzkb3.txt · Last modified: 2015/01/04 17:50 (external edit)
 
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