Silicon Pr0n

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Several groups have success with simply sanding the chip down using a Dremel or sandpaper.

Procedure

1. Glue or otherwise secure chip package to something. A ZIF socket also worked with mild success for PDIP. A specially constructed, heavy duty type might work well if this was done often enough.
2. Use sandpaper to get as close to the die as possible. Closeness can be gauged by observing the arc of the bond wires. They may be more easily observed by wetting the chip or using moderate (~10X) magnification.
3. Polishing using a Dremel with polishing paste. It is an open question if any pastes are better or should be avoided.

Advantages

• Readily available materials
• Can be tightly controlled

Disadvantages

• Higher degree of skill required for decent results
• Labor intensive
• Not suitable for live analysis (bond wires are destroyed in the process)