Differences

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--- carrier:th [2013/10/28 05:34] – [Single inline package (SIP)] mcmaster
+++ carrier:th [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 28: / Line 28: @@
 {{:carrier:csip:fujitsu_edh4464-15_bot.jpg?300|}}
 {{:carrier:csip:fujitsu_edh4464-15_side.jpg?200|}}
 ====== Dual inline package (DIP) ======
@@ Line 43: / Line 45: @@
 {{carrier:pdip:fd1791-b01_top.jpg?300}}
 {{carrier:pdip:fd1791-b01_bot.jpg?300}}
+An unusual PDIP which doesn't fully encapsulate the leadframe:
+{{:carrier:pdip:intersil_icm7217aipi_top.jpg?300|}}
+{{:carrier:pdip:intersil_icm7217aipi_bot.jpg?300|}}
+{{:carrier:pdip:intersil_icm7217aipi_side.jpg?200|}}
 One major disadvantage of PDIPs is their relatively poor heat conduction being made primarily of glass.  A 0.3" PDIP-14 with heatsink:
@@ Line 71: / Line 79: @@
 Was popular before epoxy ("plastic") chips were made commercially viable.
@@ Line 77: / Line 87: @@
 A typical package has two fired ceramic halves with a die in a center cavity held together by glass.  Most windowed chips are of this type.
 Its unusual to have the ceramic darker on part of the chip but it does make for a nice label!  I have several that are identical (to the datecode) but does not have this black background...error during silkscreening process?
@@ Line 84: / Line 93: @@
 {{carrier:cdip:wd_wd8250cl-00_bot.jpg?300}}
 {{carrier:cdip:wd_wd8250cl-00_side.jpg?200}}
-=== Windowed ===
 Erasable chips (typically EPROM but sometimes microcontrollers containing EPROM) have a quartz window:
@@ Line 98: / Line 105: @@
 A typical package is a single co-fired ceramic with a solderable lid.  Optional grounding strap.  These chips were more common in the 70/80s but still continue to see use in high end and military chips.  The last consumer chip I'm aware of was the Pentium 1 which used a dark purple ceramic.
+Pretty typical package:
-=== Windowed ===
+{{:carrier:cdip:intel_c2186-25_top.jpg?300}}
+{{:carrier:cdip:intel_c2186-25_bot.jpg?300}}
+{{:carrier:cdip:intel_c2186-25_side.jpg?200}}
+Slight variation with the grounding strap soldered directly to the lid:
+{{:carrier:cdip:ti_tms99105ajdl_top.jpg?300}}
+{{:carrier:cdip:ti_tms99105ajdl_bot.jpg?300}}
+{{:carrier:cdip:ti_tms99105ajdl_side.jpg?200}}
+An unusual package with pins to stack another chip on top (for EPROM for the MCU IIRC in this case):
+{{:carrier:cdip:nat_semi_ns87p50d-11_top.jpg?300}}
+{{:carrier:cdip:nat_semi_ns87p50d-11_bot.jpg?300}}
+{{:carrier:cdip:nat_semi_ns87p50d-11_side.jpg?200}}
+An unusual package with a lid covering the entire top:
+{{:carrier:cdip:hs_hs9378c_top.jpg?300|}}
+{{:carrier:cdip:hs_hs9378c_bot.jpg?300|}}
+{{:carrier:cdip:hs_hs9378c_side.jpg?200|}}
+Windowed:
 {{carrier:cdip:intel_c8751-8_top.jpg?300}}
 {{carrier:cdip:intel_c8751-8_bot.jpg?300}}
 {{carrier:cdip:intel_c8751-8_side.jpg?200}}
+Old windowed package with frosted glass (uncommon):
+{{:carrier:cdip:hitachi_hd462532_top.jpg?300}}
+{{:carrier:cdip:hitachi_hd462532_bot.jpg?300}}
+{{:carrier:cdip:hitachi_hd462532_side.jpg?200}}
@@ Line 133: / Line 169: @@
 {{carrier:cdip:white_cb2082_bot.jpg?300}}
-Very early ceramic package (1974 date code):
+Early ceramic package (1974 date code):
 {{carrier:cdip:white_fd502e_top.jpg?300}}
 {{carrier:cdip:white_fd502e_bot.jpg?300}}
+Early windowed ceramic package (window missing, 1979 date code?):
+{{:carrier:cdip:intel_c8702a-4_lidless_top.jpg?300}}
+{{:carrier:cdip:intel_c8702a-4_lidless_bot.jpg?300}}
+{{:carrier:cdip:intel_c8702a-4_lidless_side.jpg?200}}