Package
Pin grid array, 144 pins.
(VLSI logo) VLSI 9043AV 153542 VL86C020-PSGCP 3621-0000 KOREA
Decap
Removed metal lid by bending the edges up and levering it off the epoxy. Hot air (480C at max airflow) + bending with vice and pliers to crack the plastic away from the die.
The PCB which the die is mounted on presents a bit of trouble vs. a plastic-plus-leadframe type package. Basically keep heating, and try to make the plastic crack across the die so the plastic falls away.
Die is located in the centre of the package, sized approx 10mm square.
The die is polyimide coated - the plastic packaging may stick to it. Polyimide removal TBD.
Die
ACORN (M) VLSI (VLSI logo) (C) '88 3621 VL86C020 SBF ARW JSU HEO JRS DWH (C) ACORN 1988 (T) ACORN 1988 (Acorn logo) ACORN ARPT JSU HEO DWH
- Single (35856×40608, 216.389MiB)
Credits
Thanks to Prof. Steven Furber for kindly identifying the names behind the initials on the die:
- SBF: Steven Furber
- ARW: Sophie Wilson
- JSU: Jamie Urquhart
- HEO: Harry Oldham
- JRS: Jim Sutton
- DWH: Dave Howard
- ARPT: Alasdair Thomas
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