Package

U1 chip removed from Apple Airtag using hot air.
U1 Markings: 1HJV
NRF52832 Markings: N52832 CIAAE0 2036GK

Immersed in HNO3 to remove encapsulant to reveal package components. Then boiled in H2SO4 to remove from package substrate.
Markings: 338S00539 P04RV4.L2 99KBB686AL 1946

Die

Apple U1 Ultra-Wideband Die
Markings: TMKA75

mz_1000x

  • Single (17026×15471, 245.506MiB)
 
h1kari/apple/u1.txt · Last modified: 2021/05/12 06:26 by h1kari
 
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