Table of Contents

Gray SecurID

Images

Die markings

SMSC 2C 2C
2C5737 18A
-1P89

Chip structure

Die is approximately 2.9 X 3.1 mm

Process technology

2-metal nonplanar CMOS, fairly large dimensions (1um? 750nm?). Based on standard cells with approximately 16 horizontal interconnect channels on M1 between rows of cells and vertical interconnect on M2.

CPU

12 rows of standard cells, no estimates of total gate count yet.

Based on memory architecture it's likely a 16 bit design.

Memory

First array (top center, red)

Closeup of column outputs. Looks like 16 data bits.

Second array (top left, gray)

Current issue SID700