Table of Contents

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Xilinx CoolRunner-II CPLD with 32 macrocells. The -A version supports two I/O banks while the baseline XC2C32 only has one.

180nm 4-metal process.

Package

CPG56 - 0.5mm chip-scale BGA.

Markings:

[Xilinx logo] 2C32A
F40731-1049
PHILIPPINES
C4-AMS 6C

Die overview (metal 4)

Die size: 1895 x 1710 μm (3.24 mm^2)

Plan view closeups (metal 4)

Output bus from function block 2 macrocells to I/O bank 1

VCCIO junction

Junction between VCCIO1 (left) and VCCIO2 (right) at bottom center of die. Note vias from ground ring to ground pad at bottom.

ZIA wiring

Maps

Top metal (NS50xU)

Active area Dash etch (MIT100x)

Poly (MIT20x)

Various intermediate laps, browse around

Cross sections