Differences

This shows you the differences between two versions of the page.

--- infosecdj:start [2025/03/27 15:25] – [Commissioning work] infosecdj
+++ infosecdj:start [2025/07/25 12:42] (current) – infosecdj
@@ Line 11: / Line 11: @@
 ====== Capabilities ======
-My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only. Optics list:
+My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only. List of optics I use the most:
   * LMplan 5x/0.13
@@ Line 18: / Line 18: @@
   * Nikon Plan Apo 20x/0.75
   * Nikon Plan Apo 40x/1.0 oil
+  * Nikon Plan Apo 60x/1.40 oil
   * LMplan 50x/0.6
   * Nikon Plan Apo 100x/1.35 oil
@@ Line 29: / Line 30: @@
   * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
   * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
-  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
+  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images. For dies with more than one metal layer, results will vary.
 The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.