Differences

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--- infosecdj:start [2025/03/27 15:22] – [Capabilities] infosecdj
+++ infosecdj:start [2025/03/27 15:25] (current) – [Commissioning work] infosecdj
@@ Line 35: / Line 35: @@
 If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable. Decapping different package types:
-  * Ceramic lidded packages is universally successful just by desoldering the lid.
+  * Ceramic lidded packages is universally successful just by desoldering the lid. The chip will likely stay functional.
-  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it.
+  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it. The chip will not be functioning due to frit fracturing.
-  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc.
+  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc. The chip will not be functioning.
-  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die.
+  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die. The chip will not be functioning.
   * Other packages to be discussed.