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--- infosecdj:start [2023/04/15 00:40] – created mcmaster
+++ infosecdj:start [2025/03/27 15:25] (current) – [Commissioning work] infosecdj
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-Unless otherwise noted data is copyright "InfoSecDJ, CC BY-SA 4.0"
+Images below are taken by Dmitry "InfoSecDJ" Janushkevich.
+Unless otherwise noted, images below are copyright "InfoSecDJ, CC BY-SA 4.0"
 ====== Images ======
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+====== Capabilities ======
+My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only. Optics list:
+  * LMplan 5x/0.13
+  * LMplan 10x/0.25
+  * Nikon M Plan 20x/0.4 ELWD
+  * Nikon Plan Apo 20x/0.75
+  * Nikon Plan Apo 40x/1.0 oil
+  * LMplan 50x/0.6
+  * Nikon Plan Apo 100x/1.35 oil
+====== Commissioning work ======
+Always accepting sample donations! :-)
+I am happy to do some work for you:
+  * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
+  * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
+  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
+The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.
+If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable. Decapping different package types:
+  * Ceramic lidded packages is universally successful just by desoldering the lid. The chip will likely stay functional.
+  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it. The chip will not be functioning due to frit fracturing.
+  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc. The chip will not be functioning.
+  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die. The chip will not be functioning.
+  * Other packages to be discussed.
+Hobby/public projects are done for free; a small donation is always highly appreciated to cover material costs and wear&tear. You will have to cover shipping costs, including shipping samples back if so desired; I am EU-based so things might be simpler/faster/cheaper if you are as well.
+At this moment, I **cannot** offer commercial work, and I **won't** do anything I deem legally challenging e.g. pay-TV, smartcards, DRM, crypto.
+By default, I retain copyright and will publish the images on this site.
+If you have something that might be interesting, don't hesitate to get in touch via:
+  * Email: infosecdj at airpost punktum net
+  * DM on Mastodon: @infosecdj@infosec.exchange
+  * Wherever else you spot my nickname e.g. discord servers