Differences

This shows you the differences between two versions of the page.

--- infosecdj:philips:p83c562efa [2025/06/08 18:25] – created - external edit 127.0.0.1
+++ infosecdj:philips:p83c562efa [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
-{{tag>collection_infosecdj vendor_philips type_unknown year_unknown foundry_unknown}}
+{{tag>collection_infosecdj vendor_philips type_processor_microcontroller_8051 year_1994 foundry_unknown}}
+A 8051 derivative.
 ====== Package ======
@@ Line 7: / Line 8: @@
 <code>
+(Logo)
+P83C562EFA 503
+DfD9548V2 Y
+429-00
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1994
 </code>
-{{:infosecdj:philips:p83c562efa:pack_btm.jpg?300|}}
+====== Die ======
-<code>
+Die size: 3.9x3.8mm approx.
-</code>
+Bonding pad opening: 89 um, square.
-====== Die ======
+Metal pitch: 3.16 um.
+Poly pitch: 2.27 um.
+Poly width: 1.0 um.
+<code>
+V83C562V2
+</code>
 <code>
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1994
 </code>
-{{https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.thumb.jpg}}
+{{https://siliconprawn.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.thumb.jpg}}
-[[https://siliconpr0n.org/map/philips/p83c562efa/infosecdj_mz_nikpa40x/|mz_nikpa40x]]
+[[https://siliconprawn.org/map/philips/p83c562efa/infosecdj_mz_nikpa40x/|Top metal imaged under a Nikon Plan Apo 40x/1.0 oil]]
-  * [[https://siliconpr0n.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.jpg|Single]] (50870x50236, 526.444MiB)
+  * [[https://siliconprawn.org/map/philips/p83c562efa/single/philips_p83c562efa_infosecdj_mz_nikpa40x.jpg|Single]] (50870x50236, 526.444MiB)