infosecdj:mitsubishi:m30620mc
Differences
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| infosecdj:mitsubishi:m30620mc [2023/11/17 14:57] – infosecdj | infosecdj:mitsubishi:m30620mc [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| Line 6: | Line 6: | ||
| The die turned up in several packages. | The die turned up in several packages. | ||
| + | |||
| + | == Sample 1 == | ||
| {{: | {{: | ||
| Line 22: | Line 24: | ||
| JAPAN | JAPAN | ||
| </ | </ | ||
| + | |||
| + | == Sample 2 == | ||
| {{: | {{: | ||
| Line 49: | Line 53: | ||
| </ | </ | ||
| - | {{https://siliconpr0n.org/ | + | == Sample 1 == |
| + | |||
| + | {{https://siliconprawn.org/ | ||
| + | |||
| + | [[https:// | ||
| + | |||
| + | * [[https:// | ||
| + | |||
| + | == Sample 2 == | ||
| + | |||
| + | {{https:// | ||
| + | |||
| + | [[https:// | ||
| - | [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ |
| - | * [[https:// | + | Note fewer pins are bonded out on this die, which is how it fit into a package with lesser pin count. |
infosecdj/mitsubishi/m30620mc.1700233055.txt.gz · Last modified: 2023/11/17 14:57 by infosecdj
