Differences

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--- infosecdj:mitsubishi:m30620mc [2023/11/16 14:09] – infosecdj
+++ infosecdj:mitsubishi:m30620mc [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
 {{tag>collection_infosecdj vendor_mitsubishi type_processor_microcontroller year_1995 foundry_unknown}}
-Die cracked during decapping.
+A single-chip microcontrolled in the M16C family by Mitsubishi.
 ====== Package ======
-TODO
+The die turned up in several packages.
+== Sample 1 ==
+{{:infosecdj:mitsubishi:m30620mc:f1267-47034_top.jpg?300|}}
+<code>
+B TOYOTA
+F1267-47034
+M30622MCT-3R5FP
+PBF 5313102
+</code>
+{{:infosecdj:mitsubishi:m30620mc:f1267-47034_btm.jpg?300|}}
+<code>
+f11
+JAPAN
+</code>
+== Sample 2 ==
+{{:infosecdj:mitsubishi:m30620mc:f1517-47050_top.jpg?300|}}
+<code>
+S2 7271B7
+TOYOTA
+F1517-43050
+CUF623M8V0F6
+</code>
+{{:infosecdj:mitsubishi:m30620mc:f1517-47050_btm.jpg?300|}}
+<code>
+A50
+JAPAN
+</code>
 ====== Die ======
@@ Line 17: / Line 53: @@
 </code>
-{{https://siliconpr0n.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_lmplan10x.thumb.jpg}}
+== Sample 1 ==
+{{https://siliconprawn.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_nikon20x.thumb.jpg}}
+[[https://siliconprawn.org/map/mitsubishi/m30620mc-/infosecdj_mz_nikon20x/|Top metal imaged with Nikon 20x]]
+  * [[https://siliconprawn.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_nikon20x.jpg|Single]] (a lot MiB)
+== Sample 2 ==
+{{https://siliconprawn.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_lmplan10x.thumb.jpg}}
+[[https://siliconprawn.org/map/mitsubishi/m30620mc-/infosecdj_mz_lmplan10x/|Top metal imaged with LMplan 10x]]
-[[https://siliconpr0n.org/map/mitsubishi/m30620mc-/infosecdj_mz_lmplan10x/|Top metal imaged with LMplan 10x]]
+  * [[https://siliconprawn.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_lmplan10x.jpg|Single]] (17201x26118, 88MiB)
-  * [[https://siliconpr0n.org/map/mitsubishi/m30620mc-/single/mitsubishi_m30620mc-_infosecdj_mz_lmplan10x.jpg|Single]] (17201x26118, 88MiB)
+Note fewer pins are bonded out on this die, which is how it fit into a package with lesser pin count.