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foundry:umc [2014/07/16 20:08] azonenberg [Devices] |
foundry:umc [2015/01/04 22:50] (current) |
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| Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | ||
| + | On-die Flash/ | ||
| ==== Identification ==== | ==== Identification ==== | ||
| - | The CMP filler pattern is distinctive and can be used as positive ID. | + | The CMP filler pattern is distinctive and can be used as positive ID. Fill polygons are rectangles with 2:1 aspect ratio, long side oriented parallel to the prevailing routing direction. |
| CMP fill pattern table (measured from XC2C32A) | CMP fill pattern table (measured from XC2C32A) | ||