azonenberg:xilinx:xc2c32a
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+ | {{tag> | ||
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+ | [[vendor: | ||
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+ | 180nm 4-metal process. | ||
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+ | ====== Package ====== | ||
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+ | CPG56 - 0.5mm chip-scale BGA. | ||
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+ | Markings: | ||
+ | [Xilinx logo] 2C32A | ||
+ | F40731-1049 | ||
+ | PHILIPPINES | ||
+ | C4-AMS 6C | ||
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+ | {{: | ||
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+ | ====== Die overview (metal 4) ====== | ||
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+ | Die size: 1895 x 1710 μm (3.24 mm^2) | ||
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+ | ====== Plan view closeups (metal 4) ====== | ||
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+ | ===== Die logo ===== | ||
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+ | ===== Output bus from function block 2 macrocells to I/O bank 1 ===== | ||
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+ | ===== Copyright notice (upside-down in bottom left corner) ===== | ||
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+ | ===== VCCIO junction ===== | ||
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+ | Junction between VCCIO1 (left) and VCCIO2 (right) at bottom center of die. Note vias from ground ring to ground pad at bottom. | ||
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+ | ===== ZIA wiring ===== | ||
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+ | ====== Maps ====== | ||
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+ | [[http:// | ||
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+ | [[http:// | ||
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+ | [[http:// | ||
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+ | [[http:// | ||
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+ | ====== Cross sections ====== | ||
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