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+{{tag>collection_az vendor_ti year_unknown type_processor type_processor/microprocessor type_processor/microprocessor/arm foundry_tsmc tech_65nm}}
+====== Package ======
+-ball BGA, 1mm pitch.
+{{:azonenberg:ti:s7303205_cropped.jpg?300|}}
+====== Die ======
+nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution.
+Size is approximately 5970 x 4370 μm (26.1 mm<sup>2</sup>).
+{{:azonenberg:ti:am1707_bf_neo5x_3k.jpg?600|}}
+Bottom left corner logo. Note "TI" logo upside-down relative to text.
+{{:azonenberg:ti:am1707_25_bf_neo40x_annotated.jpg?300|}} {{:azonenberg:ti:am1707_26_bf_neo40x_annotated.jpg?300|}}
+Nice view of M6 (horizontal thick aluminum), M5 (vertical power routing), M5 (mostly CMP filler here), and M4 (can't see much).
+{{:azonenberg:ti:am1707_27_bf_neo40x_annotated.jpg?300|}}
+Upper left corner alignment markings
+{{:azonenberg:ti:am1707_28_bf_neo40x_annotated.jpg?300|}}
+Damaged bond pad showing underlying layers
+{{:azonenberg:ti:am1707_29_bf_neo40x_annotated.jpg?300|}}
+Test pattern in scribe line
+{{:azonenberg:ti:am1707_32_bf_neo40x_annotated.jpg?300|}}