Differences

This shows you the differences between two versions of the page.

--- azonenberg:microchip:23k256 [2014/04/08 07:19] – azonenberg
+++ azonenberg:microchip:23k256 [2015/01/04 22:50] (current) – external edit 127.0.0.1
@@ Line 3: / Line 3: @@
 SPI serial SRAM chip. Looks like 4 metal layers and a fairly fine process geometry.
-Definitely //not// one of Microchip's standard fan processes. CMP filler pattern is consistent with UMC 180 nm (pitch and dimensions of CMP filler and traces on both M4 and M3 match [[azonenberg:xilinx:xc2c32a]] within 3%) however this is the only evidence we have to support this conclusion at this time; tag is tentative.
+Definitely //not// one of Microchip's standard fab processes. CMP filler pattern is consistent with UMC 180 nm (pitch and dimensions of CMP filler and traces on both M4 and M3 match [[azonenberg:xilinx:xc2c32a]] within 3%) however this is the only evidence we have to support this conclusion at this time; tag is tentative.
 The die ID also does not match the normal Microchip layout and there is no Microchip logo on the die. Maybe this mask set was acquired from a buyout or something?
+There are three unbonded pads on the die. Purpose of these is unknown at this time since all known packages are 8 pins.
 ====== Package ======