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The Silicon Archive is a collection of practical integrated circuit and general electronics information. Most of it is manifested as die shots.

High resolution chip maps

Linked from pages when available and can be found at: http://siliconpr0n.org/map/ Tiles were originally output at .jpg quality 75 but since upgrading pr0n disk space in early 2013 tiles should now uploaded at .jpg quality 90.

Upon request the original images can be found at: http://siliconpr0n.org/single/ These can also be reconstructed from the map tiles (most likely at some loss of quality) by running something like “montage -geometry +0+0 -tile 73×60 *.jpg out.png”

Structure:

  • First level contains vendor name (short forms like “ti” preferred over Texas Instruments)
  • Second level contains chip name. Ideally should have enough information to determine exact mask. Ultimately an Archive wiki pages should link to the map to provide canonical details by showing a package or device image
    • Chip name should match the wiki page name
  • Next level should contain files of form <layer name>_<magnification> where
    • layer name: short description of the area imaged. For example: “top_metal”, “m2”, or “delayered_right”
    • magnification: which objective was used. See notes in “microscope objectives”

Example: “ti/tl494a/top_metal_mit5x”

  • ti: most associated with Texas Instruments (either made by, designer, or simply the most prominent package markings)
  • tlm494a: chip name including revision
  • top_metal_mit5x: layer name and magnification

Microscope objectives

Objective abbreviations

  • bli20x: Bausch & Lomb industrial 20x (designed for streozoom series)
  • ch2x: cheap supposedly Apo 2x objective that may be made of soda glass (green tinge…). Loosely resembles Seiwa objectives
  • mit5x: Mitutoyo M Plan Apo 5x
  • mit10x: Mitutoyo M Plan Apo 10x
  • mit20x: Mitutoyo M Plan Apo 20x
  • mit100x: Mitutoyo M Plan Apo 100x
  • neo5x: Olympus Neo 5x
  • ns50x: Olympus Neo SPlan 50x
  • ns50xu: Olympus Neo SPlan 50x ultra-long working distance (ULWD)

NOTE: typically involves 10x relay lens to make actual magnification times 10. For example, a Mit20x objective is used with a 10x relay lens to make the final image at 200x magnification on the CCD. However, chip pages should specify net die size if actual size is important as sensor size has no relation to pixel size, especially in stitched images.

SEM images

TODO: standardize SEM image naming. There aren't enough images yet to make this important

azonenberg's semi-standard is as follows: foo_20kV_2kx_3e-11a_15mm_ap4_se_01.jpg

  • Sample “foo”
  • 20kV accelerating voltage
  • 2000x magnification
  • 3e-11A probe current
  • 15mm working distance
  • Aperture #4 (actual size depends on the specific instrument in use)
  • Secondary electron image (other legal values are “bse”, “eds”)
  • Image number 1 of the set
 
start.1366598357.txt.gz · Last modified: 2013/04/22 02:39 by azonenberg
 
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