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package:materials [2013/05/05 02:07] mcmaster |
package:materials [2015/01/04 22:50] (current) |
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| | | Solder | | | Solder | ||
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| + | ====== Altera ====== | ||
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| + | Uses amkor, see http:// | ||
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| ====== Cypress ====== | ====== Cypress ====== | ||
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| | | Adhesive | | | Adhesive | ||
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| + | ====== HANA Microelectronics group ====== | ||
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| + | http:// | ||
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| + | Sample of packages to include all epoxy and die attach materials | ||
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| + | ^ Package ^ Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^ | ||
| + | | PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR | | ||
| + | | PDIP | Y | 2200D | 2200D | G600 | | ||
| + | | SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
| + | | SOIC | Y | 2200D | 2200D | G600 | | ||
| + | | MSOP | N | 84-1LMISR4 | 843J | MP8000AN/ | ||
| + | | MSOP | Y | 2200D | 2200D | G600 | | ||
| + | | MSOP (clear) | N | N/A | N/A | MG97-8006A | | ||
| + | | SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
| + | | SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 | | ||
| + | | SOT223 | N | 84-1LMISR4 | 843J | MP8000CH | | ||
| + | | SOT223 | Y | 8290 | 8290 | G600 | | ||
| + | | SOT5x3 | N | N/A | N/A | MP8000AN | | ||
| + | | SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F | | ||
| + | | LGA | N | 84-1LMISR4 | 843J | N/A | | ||
| + | | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H | | ||
| + | | LGA | N | 84-1LMISR4 | 843J | EME6710S | | ||
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| + | |||
| + | ====== Maxim ====== | ||
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| + | http:// | ||
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| http:// | http:// | ||
| - | [[http:// | + | ===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE ===== |
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| + | http:// | ||
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| + | ^ Package ^ Mold material ^ Site ^ | ||
| + | | PQFP | Sumitomo EME 6300HJ | Philippines | | ||
| + | | PQFP | Sumitomo G700M | Philippines | | ||
| + | | PDIP non-Pb free | Sumitomo EME 6300H | Philippines | | ||
| + | | PDIP non-Pb free | Sumitomo G600 | Philippines | | ||
| + | | PDIP Pb free | DongJin DMC 2000HG | Philippines | | ||
| + | | PDIP Pb free | Sumitomo G600 | Philippines | | ||
| + | | RQFP | Sumitomo EME-6300H | Korea | | ||
| + | | RQFP | Nitto MP8000CH4 | Korea | | ||
| + | | RQFP | Sumitomo G700M | Korea | | ||
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| + | |||
| + | ===== Mindspeed product change note ===== | ||
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| + | http:// | ||
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| + | Selected packages | ||
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| + | 80 pin PQFP | ||
| * Mold compound: Nitto MP8000CH4 | * Mold compound: Nitto MP8000CH4 | ||
| * Die Attach: Ablestik 8361J | * Die Attach: Ablestik 8361J | ||
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| * Marking: Ink | * Marking: Ink | ||
| - | [[http:// | + | 128 pin LQFP |
| * Mold compound: Sumitomo 7320CR | * Mold compound: Sumitomo 7320CR | ||
| * Die Attach: Ablestik 84-1 LMISR4 | * Die Attach: Ablestik 84-1 LMISR4 | ||
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| * Marking: Ink | * Marking: Ink | ||
| - | [[http:// | + | 128 pin LQFP |
| * Mold compound: Sumitomo EME-G700L | * Mold compound: Sumitomo EME-G700L | ||
| * Die Attach: Ablestik 3230 | * Die Attach: Ablestik 3230 | ||