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package:materials [2012/07/31 06:46] mcmaster [PDIP (power)] |
package:materials [2015/01/04 22:50] (current) |
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+ | ====== Altera ====== | ||
+ | |||
+ | Uses amkor, see http:// | ||
+ | |||
+ | |||
+ | ====== Cypress ====== | ||
+ | |||
+ | ===== 32.45-lead Plastic Small Outline Package (SOIC) ===== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | * Package Designation: | ||
+ | * Package Outline, Type, or Name: 32-lead Plastic Small Outline IC (SOIC) | ||
+ | * Mold Compound Name/ | ||
+ | * Mold Compound Flammability Rating: V-O per UL94 | ||
+ | * Oxygen Rating Index: | ||
+ | * Lead Frame Designation: | ||
+ | * Lead Frame Material: | ||
+ | * Lead Finish, Composition / Thickness: | ||
+ | * Die Backside Preparation Method/ | ||
+ | * Die Separation Method: | ||
+ | * Die Attach Supplier: | ||
+ | * Die Attach Material: | ||
+ | * Bond Diagram Designation | ||
+ | * Wire Bond Method: | ||
+ | * Wire Material/ | ||
+ | * Thermal Resistance Theta JA °C/ | ||
+ | * Package Cross Section Yes/ | ||
+ | * Assembly Process Flow: | ||
+ | * Name/ | ||
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| | Adhesive | | | Adhesive | ||
| | | | ||
+ | |||
+ | |||
+ | ====== HANA Microelectronics group ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | Sample of packages to include all epoxy and die attach materials | ||
+ | |||
+ | ^ Package ^ Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^ | ||
+ | | PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR | | ||
+ | | PDIP | Y | 2200D | 2200D | G600 | | ||
+ | | SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
+ | | SOIC | Y | 2200D | 2200D | G600 | | ||
+ | | MSOP | N | 84-1LMISR4 | 843J | MP8000AN/ | ||
+ | | MSOP | Y | 2200D | 2200D | G600 | | ||
+ | | MSOP (clear) | N | N/A | N/A | MG97-8006A | | ||
+ | | SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
+ | | SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 | | ||
+ | | SOT223 | N | 84-1LMISR4 | 843J | MP8000CH | | ||
+ | | SOT223 | Y | 8290 | 8290 | G600 | | ||
+ | | SOT5x3 | N | N/A | N/A | MP8000AN | | ||
+ | | SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F | | ||
+ | | LGA | N | 84-1LMISR4 | 843J | N/A | | ||
+ | | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H | | ||
+ | | LGA | N | 84-1LMISR4 | 843J | EME6710S | | ||
+ | |||
+ | |||
+ | ====== Maxim ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | |||
+ | ====== Microchip ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | ====== Mindspeed ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | Product change notification that describes switch from Skyworks to Amkor encapsulation provider. | ||
+ | |||
+ | ====== Skyworks ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | [[http:// | ||
+ | * Mold compound: Sumitomo 6650E | ||
+ | * Die Attach: Ablestik 8361J | ||
+ | * Lead Frame: Cu 194 | ||
+ | * Lead Coating: 85/15 Sn/Pb | ||
+ | * Wire: 1.25 mil Au | ||
+ | * Marking: Ink | ||
+ | |||
+ | [[http:// | ||
+ | * Mold compound: Sumitomo 7351LS | ||
+ | * Die Attach: CRM-M0209 | ||
+ | * Lead Frame: Cu 194 | ||
+ | * Lead Coating: 85/15 Sn/Pb | ||
+ | * Wire: 1.25 mil Au | ||
+ | * Marking: Ink | ||
+ | |||
+ | |||
+ | ====== Amkor ====== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | ===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE ===== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | ^ Package ^ Mold material ^ Site ^ | ||
+ | | PQFP | Sumitomo EME 6300HJ | Philippines | | ||
+ | | PQFP | Sumitomo G700M | Philippines | | ||
+ | | PDIP non-Pb free | Sumitomo EME 6300H | Philippines | | ||
+ | | PDIP non-Pb free | Sumitomo G600 | Philippines | | ||
+ | | PDIP Pb free | DongJin DMC 2000HG | Philippines | | ||
+ | | PDIP Pb free | Sumitomo G600 | Philippines | | ||
+ | | RQFP | Sumitomo EME-6300H | Korea | | ||
+ | | RQFP | Nitto MP8000CH4 | Korea | | ||
+ | | RQFP | Sumitomo G700M | Korea | | ||
+ | |||
+ | |||
+ | ===== Mindspeed product change note ===== | ||
+ | |||
+ | http:// | ||
+ | |||
+ | Selected packages | ||
+ | |||
+ | 80 pin PQFP | ||
+ | * Mold compound: Nitto MP8000CH4 | ||
+ | * Die Attach: Ablestik 8361J | ||
+ | * Lead Frame: Cu 194 | ||
+ | * Lead Coating: 85/15 Sn/Pb | ||
+ | * Wire: 1.0 mil Au | ||
+ | * Marking: Ink | ||
+ | |||
+ | 128 pin LQFP | ||
+ | * Mold compound: Sumitomo 7320CR | ||
+ | * Die Attach: Ablestik 84-1 LMISR4 | ||
+ | * Lead Frame: Cu 194 | ||
+ | * Lead Coating: 85/15 Sn/Pb | ||
+ | * Wire: 1.0 mil Au | ||
+ | * Marking: Ink | ||
+ | |||
+ | 128 pin LQFP | ||
+ | * Mold compound: Sumitomo EME-G700L | ||
+ | * Die Attach: Ablestik 3230 | ||
+ | * Lead Frame: Cu 194 | ||
+ | * Lead Coating: 85/15 Sn/Pb | ||
+ | * Wire: 1.0 mil Au | ||
+ | * Marking: Ink | ||
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====== Xilinx ====== | ====== Xilinx ====== | ||
- | + | [[:vendor:xilinx:package]] | |
- | ===== FG676 Package for Spartan-6 FPGAs ===== | + | |
- | + | ||
- | Based on http:// | + | |
- | + | ||
- | ^ Component ^ Material ^ % component ^ % package ^ | + | |
- | | Si die | Si | 100 | 2.430 | | + | |
- | | Die attach | + | |
- | | | Bismaleimide monomer | + | |
- | | | Acrylate monomer | + | |
- | | Mold compound | + | |
- | | | Phenol resin | 5.00 | 2.25 | | + | |
- | | | Fused silica | + | |
- | | | Metal hydroxide | + | |
- | | | Carbon black | 0.55 | 0.248 | | + | |
- | | Gold wire | Au | 99.05 | 0.586 | | + | |
- | | | Pd | 0.95 |0.00562| | + | |
- | | | Ca | 0.00 | 0.00 | | + | |
- | | Solder balls | Sn | 63.00 | 13.61 | | + | |
- | | | Pb | 37.00 | 7.99 | | + | |
- | + | ||
- | + | ||
- | ===== TQG144 ===== | + | |
- | + | ||
- | http://www.xilinx.com/ | + | |
- | + | ||
- | + | ||
- | ===== FFG1152 ===== | + | |
- | + | ||
- | http:// | + | |