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--- package:materials [2012/07/29 23:21]
mcmaster [Ceramic]
+++ package:materials [2015/01/04 22:50] (current)
@@ Line 68: / Line 68: @@
+====== Altera ======
+Uses amkor, see http://www.altera.com/literature/pcn/pcn0702.pdf
+====== Cypress ======
+===== 32.45-lead Plastic Small Outline Package (SOIC) =====
+http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf‎
+  * Package Designation:                           S32456
+  * Package Outline, Type, or Name: 32-lead Plastic Small Outline IC (SOIC)
+  * Mold Compound Name/Manufacturer: NITTO MP8000CH4-A2
+  * Mold Compound Flammability Rating: V-O per UL94
+  * Oxygen Rating Index:                           >28%
+  * Lead Frame Designation:                        S
+  * Lead Frame Material:                           Copper
+  * Lead Finish, Composition / Thickness:          Solder Plated 85%Sn - 15% Pb)
+  * Die Backside Preparation Method/Metallization: N/A
+  * Die Separation Method:                         Wafer Saw
+  * Die Attach Supplier:                           Ablestik
+  * Die Attach Material:                           Ablestik 8361H
+  * Bond Diagram Designation                       10-03242
+  * Wire Bond Method:                              Gold Wire Bonding
+  * Wire Material/Size:                            Gold/ 1.30mil
+  * Thermal Resistance Theta JA °C/W:              56
+  * Package Cross Section Yes/No:                  N/A
+  * Assembly Process Flow:                         11-21000M
+  * Name/Location of Assembly (prime) facility:    Cypress Philipines (CSPI-R)
@@ Line 107: / Line 137: @@
 |                 | Adhesive      | Ag |  | 0.083240 |
 |                 |               | Si |  | 0.016648 |
+====== HANA Microelectronics group ======
+http://www.hanagroup.com/pkg_ayt/bom.pdf
+Sample of packages to include all epoxy and die attach materials
+^ Package ^  Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^
+| PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR |
+| PDIP | Y | 2200D | 2200D | G600 |
+| SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH |
+| SOIC | Y | 2200D | 2200D | G600 |
+| MSOP | N | 84-1LMISR4 | 843J | MP8000AN/CH4 |
+| MSOP | Y | 2200D | 2200D | G600 |
+| MSOP (clear) | N | N/A | N/A | MG97-8006A |
+| SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH |
+| SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 |
+| SOT223 | N | 84-1LMISR4 | 843J | MP8000CH |
+| SOT223 | Y | 8290 | 8290 | G600 |
+| SOT5x3 | N | N/A | N/A | MP8000AN |
+| SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F |
+| LGA | N | 84-1LMISR4 | 843J | N/A |
+| LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H |
+| LGA | N | 84-1LMISR4 | 843J | EME6710S |
+====== Maxim ======
+http://www.maximintegrated.com/emmi/msds.cfm
+====== Microchip ======
+http://ww1.microchip.com/downloads/en/EnvironmentalInformation/Material%20Content%20Declarations_MCDg.pdf
+====== Mindspeed ======
+http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
+Product change notification that describes switch from Skyworks to Amkor encapsulation provider.
+====== Skyworks ======
+http://www.skyworksinc.com/
+[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]]
+  * Mold compound: Sumitomo 6650E
+  * Die Attach: Ablestik 8361J
+  * Lead Frame: Cu 194
+  * Lead Coating: 85/15 Sn/Pb
+  * Wire: 1.25 mil Au
+  * Marking: Ink
+[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]]
+  * Mold compound: Sumitomo 7351LS
+  * Die Attach: CRM-M0209
+  * Lead Frame: Cu 194
+  * Lead Coating: 85/15 Sn/Pb
+  * Wire: 1.25 mil Au
+  * Marking: Ink
+====== Amkor ======
+http://www.amkor.com/
+===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE =====
+http://www.altera.com/literature/pcn/pcn0702.pdf
+^ Package ^ Mold material ^ Site ^
+| PQFP | Sumitomo EME 6300HJ | Philippines |
+| PQFP | Sumitomo G700M | Philippines |
+| PDIP non-Pb free | Sumitomo EME 6300H | Philippines |
+| PDIP non-Pb free | Sumitomo G600 | Philippines |
+| PDIP Pb free | DongJin DMC 2000HG | Philippines |
+| PDIP Pb free | Sumitomo G600 | Philippines |
+| RQFP | Sumitomo EME-6300H | Korea |
+| RQFP | Nitto MP8000CH4 | Korea |
+| RQFP | Sumitomo G700M | Korea |
+===== Mindspeed product change note =====
+http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
+Selected packages
+pin PQFP
+  * Mold compound: Nitto MP8000CH4
+  * Die Attach: Ablestik 8361J
+  * Lead Frame: Cu 194
+  * Lead Coating: 85/15 Sn/Pb
+  * Wire: 1.0 mil Au
+  * Marking: Ink
+pin LQFP
+  * Mold compound: Sumitomo 7320CR
+  * Die Attach: Ablestik 84-1 LMISR4
+  * Lead Frame: Cu 194
+  * Lead Coating: 85/15 Sn/Pb
+  * Wire: 1.0 mil Au
+  * Marking: Ink
+pin LQFP
+  * Mold compound: Sumitomo EME-G700L
+  * Die Attach: Ablestik 3230
+  * Lead Frame: Cu 194
+  * Lead Coating: 85/15 Sn/Pb
+  * Wire: 1.0 mil Au
+  * Marking: Ink
@@ Line 133: / Line 275: @@
 | Leadfinishing   | Sn    | Sn    |       | 0.30  |
+===== PDIP (standard) =====
+Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 86
+^ Component ^ Overall material     ^ Material ^ % component ^ % package ^
+| Leadframe|Cu alloy, Ag plating| Cu            |       | 27.40 |
+|                   |           | Fe            |       | 0.65  |
+|                   |           | P             |       | 0.028 |
+|                   |           | Ag            |       | 0.028 |
+| Encapsulation  | Epoxy resin  | SiO2          |       | 49    |
+|                   |           | Epoxy         |       | 19    |
+|                   |           | Sb2O3         |       | 1.4   |
+|                   |           | Br (TBBA)     |       | 0.7   |
+| Chip              | Doped Si  | Si            |       | 0.994 |
+|                   |           | Al            |       | 0.006 |
+| Die bonding       | Glue      | Ag            |       | 0.038 |
+|                   |           | Epoxy resin   |       | 0.013 |
+| Wires             | Au        | Au            |       | 0.15  |
+|Leadfinishing (Non-RoHS?)| Sn/Pb|Sn            |       | 0.42  |
+|                   |           | Pb            |       | 0.28  |
+|Leadfinishing (RoHS?)|Sn       | Sn            |       | 0.7   |
+===== PDIP (power) =====
+Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 88.
+This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better
+thermal conductivity
+^ Component ^ Overall material     ^ Material ^ % component ^ % package ^
+| Leadframe|Cu alloy, Ag plating| Cu            |       | 45.53 |
+|                   |           | Fe            |       | 1.07  |
+|                   |           | P             |       | 0.047 |
+|                   |           | Ag            |       | 0.047 |
+| Encapsulation  | Epoxy resin  | SiO2          |       | 35.70 |
+|                   |           | Epoxy         |       | 13.77 |
+|                   |           | Sb2O3         |       | 1.02  |
+|                   |           | Br (TBBA)     |       | 0.51  |
+| Chip              | Doped Si  | Si            |       | 0.994 |
+|                   |           | Al            |       | 0.006 |
+| Die bonding       |Soft solder| Pb            |       | 0.300 |
+|                   |           | Sn            |       | 0.016 |
+|                   |           | Ag            |       | 0.0048|
+| Wires             | Au        | Au            |       | 0.25  |
+|Leadfinishing (Non-RoHS?)| Sn/Pb|Sn            |       | 0.62  |
+|                   |           | Pb            |       | 0.11  |
+|Leadfinishing (RoHS?)|Sn       | Sn            |       | 0.73  |
+====== Xilinx ======
+[[:vendor:xilinx:package]]

--- sidebar [2024/04/22 04:35]
azonenberg
+++ sidebar [2024/04/22 04:36] (current)
azonenberg old revision restored (2022/05/21 00:28)
@@ Line 1: / Line 1: @@
-{{tag>collection_az year_unknown vendor_microchip vendor_micrel type_interface type_interface/serdes type_interface/serdes/ethernet type_network type_network/ethernet foundry_tsmc tech_65nm}}
+[[:start|Top level]]
-Tech node info comes from IBIS file "[Source]      Made by TSMC 65nm IBIS model file"
+Lists of devices
-http://ww1.microchip.com/downloads/en/DeviceDoc/ksz9031%20IBIS.zip
-TODO: actually decap one :){{https://siliconpr0n.org/map/micrel/ksz9031rnx/single/micrel_ksz9031rnx_azonenberg_mz_mit20x.thumb.jpg}}
+    *  [[:collection|Collection]]
+      * See for copyright info
+    * [[:foundry:start|Foundry]]
+    * [[:tech:start|Process technology]]
+    * [[:type|Type]]
+    * [[:vendor:start|Vendor]]
+    * [[:year|Year]]
-[[https://siliconpr0n.org/map/micrel/ksz9031rnx/azonenberg_mz_mit20x/|mz_mit20x]]
+For newcomers
-  * [[https://siliconpr0n.org/map/micrel/ksz9031rnx/single/micrel_ksz9031rnx_azonenberg_mz_mit20x.jpg|Single]] (12317x8766, 24.8946MiB)
+    * [[:navigation|Navigating the site]]
+    * [[:your_first_page|Writing your first page]]
+Other
+    * [[:conventions|Conventions]] for naming etc
+    * [[:digitized|List of digitized chips]]
+    * [[:Counterfeit]]
+    * [[:true_mask_art|True mask art]]
+    * [[:Package|Package]]
+    * [[:stdcell|Cell libaries]]
+    * [[:hdl|HDL]]
+    * [[:prog:start|Programming]]
+    * [[:TODO|TODO]]
+    * [[:Links]]