This shows you the differences between two versions of the page.
| Both sides previous revision Previous revision Next revision | Previous revision | ||
|
package:materials [2012/07/29 23:18] mcmaster |
package:materials [2015/01/04 22:50] (current) |
||
|---|---|---|---|
| Line 68: | Line 68: | ||
| + | ====== Altera ====== | ||
| + | |||
| + | Uses amkor, see http:// | ||
| + | |||
| + | |||
| + | ====== Cypress ====== | ||
| + | |||
| + | ===== 32.45-lead Plastic Small Outline Package (SOIC) ===== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | * Package Designation: | ||
| + | * Package Outline, Type, or Name: 32-lead Plastic Small Outline IC (SOIC) | ||
| + | * Mold Compound Name/ | ||
| + | * Mold Compound Flammability Rating: V-O per UL94 | ||
| + | * Oxygen Rating Index: | ||
| + | * Lead Frame Designation: | ||
| + | * Lead Frame Material: | ||
| + | * Lead Finish, Composition / Thickness: | ||
| + | * Die Backside Preparation Method/ | ||
| + | * Die Separation Method: | ||
| + | * Die Attach Supplier: | ||
| + | * Die Attach Material: | ||
| + | * Bond Diagram Designation | ||
| + | * Wire Bond Method: | ||
| + | * Wire Material/ | ||
| + | * Thermal Resistance Theta JA °C/ | ||
| + | * Package Cross Section Yes/ | ||
| + | * Assembly Process Flow: | ||
| + | * Name/ | ||
| Line 107: | Line 137: | ||
| | | Adhesive | | | Adhesive | ||
| | | | | ||
| + | |||
| + | |||
| + | ====== HANA Microelectronics group ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | Sample of packages to include all epoxy and die attach materials | ||
| + | |||
| + | ^ Package ^ Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^ | ||
| + | | PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR | | ||
| + | | PDIP | Y | 2200D | 2200D | G600 | | ||
| + | | SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
| + | | SOIC | Y | 2200D | 2200D | G600 | | ||
| + | | MSOP | N | 84-1LMISR4 | 843J | MP8000AN/ | ||
| + | | MSOP | Y | 2200D | 2200D | G600 | | ||
| + | | MSOP (clear) | N | N/A | N/A | MG97-8006A | | ||
| + | | SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH | | ||
| + | | SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 | | ||
| + | | SOT223 | N | 84-1LMISR4 | 843J | MP8000CH | | ||
| + | | SOT223 | Y | 8290 | 8290 | G600 | | ||
| + | | SOT5x3 | N | N/A | N/A | MP8000AN | | ||
| + | | SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F | | ||
| + | | LGA | N | 84-1LMISR4 | 843J | N/A | | ||
| + | | LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H | | ||
| + | | LGA | N | 84-1LMISR4 | 843J | EME6710S | | ||
| + | |||
| + | |||
| + | ====== Maxim ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | |||
| + | ====== Microchip ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | ====== Mindspeed ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | Product change notification that describes switch from Skyworks to Amkor encapsulation provider. | ||
| + | |||
| + | ====== Skyworks ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | [[http:// | ||
| + | * Mold compound: Sumitomo 6650E | ||
| + | * Die Attach: Ablestik 8361J | ||
| + | * Lead Frame: Cu 194 | ||
| + | * Lead Coating: 85/15 Sn/Pb | ||
| + | * Wire: 1.25 mil Au | ||
| + | * Marking: Ink | ||
| + | |||
| + | [[http:// | ||
| + | * Mold compound: Sumitomo 7351LS | ||
| + | * Die Attach: CRM-M0209 | ||
| + | * Lead Frame: Cu 194 | ||
| + | * Lead Coating: 85/15 Sn/Pb | ||
| + | * Wire: 1.25 mil Au | ||
| + | * Marking: Ink | ||
| + | |||
| + | |||
| + | ====== Amkor ====== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | ===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE ===== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | ^ Package ^ Mold material ^ Site ^ | ||
| + | | PQFP | Sumitomo EME 6300HJ | Philippines | | ||
| + | | PQFP | Sumitomo G700M | Philippines | | ||
| + | | PDIP non-Pb free | Sumitomo EME 6300H | Philippines | | ||
| + | | PDIP non-Pb free | Sumitomo G600 | Philippines | | ||
| + | | PDIP Pb free | DongJin DMC 2000HG | Philippines | | ||
| + | | PDIP Pb free | Sumitomo G600 | Philippines | | ||
| + | | RQFP | Sumitomo EME-6300H | Korea | | ||
| + | | RQFP | Nitto MP8000CH4 | Korea | | ||
| + | | RQFP | Sumitomo G700M | Korea | | ||
| + | |||
| + | |||
| + | ===== Mindspeed product change note ===== | ||
| + | |||
| + | http:// | ||
| + | |||
| + | Selected packages | ||
| + | |||
| + | 80 pin PQFP | ||
| + | * Mold compound: Nitto MP8000CH4 | ||
| + | * Die Attach: Ablestik 8361J | ||
| + | * Lead Frame: Cu 194 | ||
| + | * Lead Coating: 85/15 Sn/Pb | ||
| + | * Wire: 1.0 mil Au | ||
| + | * Marking: Ink | ||
| + | |||
| + | 128 pin LQFP | ||
| + | * Mold compound: Sumitomo 7320CR | ||
| + | * Die Attach: Ablestik 84-1 LMISR4 | ||
| + | * Lead Frame: Cu 194 | ||
| + | * Lead Coating: 85/15 Sn/Pb | ||
| + | * Wire: 1.0 mil Au | ||
| + | * Marking: Ink | ||
| + | |||
| + | 128 pin LQFP | ||
| + | * Mold compound: Sumitomo EME-G700L | ||
| + | * Die Attach: Ablestik 3230 | ||
| + | * Lead Frame: Cu 194 | ||
| + | * Lead Coating: 85/15 Sn/Pb | ||
| + | * Wire: 1.0 mil Au | ||
| + | * Marking: Ink | ||
| ====== ST ====== | ====== ST ====== | ||
| - | ===== Ceramic | + | ===== CerDIP |
| Based on ST chemical content of semiconductor packaging: http:// | Based on ST chemical content of semiconductor packaging: http:// | ||
| ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ | ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ | ||
| - | | Base | Al2O3 | Al2O3 | | | 30.85 | | + | | Base | Alumina |
| - | | | + | | |
| - | | Cup | + | | Cup |
| - | | | + | | |
| - | | Leadframe | + | | Leadframe |
| - | | | + | | |
| - | | Sealing glass |Silicates| PbO | | | 9.79 | | + | | Sealing glass |Silicates| PbO |
| - | | | + | | |
| - | | | + | | |
| - | | Chip (doped Si) | | Si | + | | Chip (doped Si) | | Si | | 0.44 | |
| - | | | + | | |
| - | | Die bonding | + | | Die bonding |
| - | | | + | | |
| - | | | + | | |
| - | | Wires (Al) | | Al | + | | Wires (Al) | | Al | | 0.04 | |
| - | | Leadfinishing | + | | Leadfinishing |
| + | |||
| + | |||
| + | ===== PDIP (standard) ===== | ||
| + | |||
| + | Based on ST chemical content of semiconductor packaging: http:// | ||
| + | |||
| + | ^ Component ^ Overall material | ||
| + | | Leadframe|Cu alloy, Ag plating| Cu | | 27.40 | | ||
| + | | | ||
| + | | | ||
| + | | | ||
| + | | Encapsulation | ||
| + | | | ||
| + | | | ||
| + | | | ||
| + | | Chip | Doped Si | Si | | 0.994 | | ||
| + | | | ||
| + | | Die bonding | ||
| + | | | ||
| + | | Wires | Au | Au | | 0.15 | | ||
| + | |Leadfinishing (Non-RoHS? | ||
| + | | | ||
| + | |Leadfinishing (RoHS? | ||
| + | |||
| + | |||
| + | ===== PDIP (power) ===== | ||
| + | |||
| + | Based on ST chemical content of semiconductor packaging: http:// | ||
| + | This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better | ||
| + | thermal conductivity | ||
| + | |||
| + | ^ Component ^ Overall material | ||
| + | | Leadframe|Cu alloy, Ag plating| Cu | | 45.53 | | ||
| + | | | ||
| + | | | ||
| + | | | ||
| + | | Encapsulation | ||
| + | | | ||
| + | | | ||
| + | | | ||
| + | | Chip | Doped Si | Si | | 0.994 | | ||
| + | | | ||
| + | | Die bonding | ||
| + | | | ||
| + | | | ||
| + | | Wires | Au | Au | | 0.25 | | ||
| + | |Leadfinishing (Non-RoHS? | ||
| + | | | ||
| + | |Leadfinishing (RoHS? | ||
| + | |||
| + | |||
| + | |||
| + | ====== Xilinx ====== | ||
| + | [[: | ||