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Table of Contents
SIM card from an old AT&T cell phone.
Package
Die carrier
Die
Size is approximately 2000 x 1340 μm (2.68 mm2).
Top layer
The mesh appears pretty weak: one serpentine line zigzagging back and forth with ~850 nm pitch (probably 400-500 nm lines, consistent with the ~180 nm technology node). Since it appears there's only one net there would be no penalty for shorting adjacent lines together, or for cutting out a sizeable area and bypassing it.
Next layer down
HF etched until mesh removal, but not imaged yet.
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